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2022

  1. Jia-Yi Lee, Chih-Ming Chen* (陳志銘), 2022 July, “Effects of Initial Morphology on Growth Kinetics of Cu6Sn5 at SAC305/Cu Interface During Isothermal Aging”, Materials, Vol. 15, 4751. (https://doi.org/10.3390/ma15144751.)
     

  2. Hong-Da Chang, Bei-En Wu, Manik Chandra Sil, Zong-Hao Yang, and Chih-Ming Chen* (陳志銘), 2022 August, “Study of synergy of monoethanolamine and urea on copper corrosion inhibition in alkaline solution”, Journal of Molecular Liquids, Vol. 359, 119344. (https://doi.org/10.1016/j.molliq.2022.119344)
     

  3. Li-Chi Huang, Yan-Ping Zhang, Chih-Ming Chen* (陳志銘), Liang-Yih Hung, Yu-Po Wang, 2022 June, “Interfacial reactions between pure indium solder and Au/Ni metallization”, Journal of Materials Science: Materials in Electronics, Vol. 33, pp.13143-13151.  (https://doi.org/10.1007/s10854-022-08253-2)
     

  4. Pei-Hsuan Chang, Manik Chandra Sil, Kamani Sudhir K. Reddy, Ching-Hsuan Lin, and Chih-Ming Chen* (陳志銘), 2022 May, “Polyimide-based covalent organic framework as a photocurrent enhancer for efficient dye-sensitized solar cells”, ACS Applied Materials & Interfaces, Vol. 14, pp. 25466–25477. (https://doi.org/10.1021/acsami.2c04507)
     

  5. Po-Kai Chen, Yu-Ju Li, Yee-Wen Yen, and Chih-Ming Chen* (陳志銘), 2022 May, “Influences of impurity incorporation in electroplated Cu on the SnAgCu and Ni-containing SnAgCu solder joints”, Journal of the Electrochemical Society, Vol. 169, 052508. (https://doi.org/10.1149/1945-7111/ac7105)
     

  6. Yohanes Hutabalian, Chih-Ming Chen(陳志銘), Hsu-Hui Chen, Zhi-Kai Hu, and Sinn-Wen Chen*, 2022 April, “Interfacial reactions in Ni/Se-90 at.%Te and Ni/Pb1-xSnxSe couples”, Materials Chemistry and Physics, Vol. 282, 125959. (https://doi.org/10.1016/j.matchemphys.2022.125959)
     

  7. Jhih-Jhu Jhan, Kazutoshi Wataya, Hiroshi Nishikawa, and Chih-Ming Chen* (陳志銘), 2022 March, “Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding”, Journal of the Taiwan Institute of Chemical Engineers, Vol. 132, 104127. (https://doi.org/10.1016/j.jtice.2021.10.027)
     

  8. Shao-Yu Hsu, Chih-Ming Chen*(陳志銘), Jenn-Ming Song, and Hiroshi Nishikawa, 2022 February, “Surface modification of Cu electroplated layers for Cu-Sn transient liquid phase bonding”, Materials Chemistry and Physics, Vol. 277, 125621. (https://doi.org/10.1016/j.matchemphys.2021.125621)
     

  9. Li-Chi Huang, Yan-Ping Zhang, Chih-Ming Chen* (陳志銘), Liang-Yih Hung, Yu-Po Wang, 2022 February, “Intermetallic compound formation and growth behavior at the interface between indium and Au/Ni(V) metallization”, Materials Characterization, Vol. 184, 111673. (https://doi.org/10.1016/j.matchar.2021.111673)
     

  10. Ya-Ching Chang, Manik Chandra Sil, Yan-Ping Zhang, Shu-Chiao Chou, Ying-Xing Liu, Si-Yu Li*, and Chih-Ming Chen* (陳志銘), 2022 February, “Surface co-silanization engineering to enhance amine functionality for adhesive heterojunction and antimicrobial application”, Composites Science and Technology, Vol. 218, 109196. (https://doi.org/10.1016/j.compscitech.2021.109196)

2021

  1. Yan-Ping Zhang, Manik Chandra Sil, and Chih-Ming Chen* (陳志銘), 2021 November, “Organosiloxane nanolayer as diffusion barrier for Cu Metallization on Si”, Applied Surface Science, Vol. 567, 150800. (https://doi.org/10.1016/j.apsusc.2021.150800) 
     

  2. Manik Chandra Sil, Hong-Da Chang, Jhih-Jhu Jhan, and Chih-Ming Chen* (陳志銘), 2021 September, “Electropolymerization of Poly(spiroBiProDOT) on Counter Electrode for Platinum-free Dye Sensitized Solar Cells”, Journal of Materials Chemistry C, Vol. 9, pp. 12094-12101. (https://doi.org/10.1039/D1TC02712C) (Selected as Front Cover)
     

  3. Li-Syuan Chen, Manik Chandra Sil, Yu-Hsin Lee, Heng-Jui Liu*, and Chih-Ming Chen* (陳志銘), 2021 September, “Hybrid Titanium dioxide/Sericite light scattering layer to Enhance Light Harvesting of Dye-sensitized Solar Cells”, Electrochimica Acta, Vol. 390, 138820. (https://doi.org/10.1016/j.electacta.2021.138820)
     

  4. Li-Syuan Chen, Manik Chandra Sil, Cheng-Chung Chang*, and Chih-Ming Chen* (陳志銘), 2021 July, “Optimization of Photoelectrode by Structural Engineering for Efficiency Improvement of Dye-sensitized Solar Cells at Different Light Intensity”, Journal of Alloys and Compounds, Vol. 870, 159478. (https://doi.org/10.1016/j.jallcom.2021.159478)
     

  5. Ping-Chen Chiang, Yu-An Shen*, and Chih-Ming Chen* (陳志銘), 2021 May, “Effects of Impurities on Void Formation at the Interface between Sn-3.0Ag-0.5Cu and Cu Electroplated Films”, Journal of Materials Science: Materials in Electronics, Vol. 32, pp. 11944–11951. (https://doi.org/10.1007/s10854-021-05824-7) 
     

  6. Zeyang Zheng, Yu-Ting Huang, Zhenyu Wang, Chih-Chun Chung, Sheng-Jye Cherng, Wei-Ting Wang, Mingyang Zhang, Ya-Hui Tsai, Po-Chien Li, Zhouguang Lu, Chih-Ming Chen* (陳志銘), Shien-Ping Feng*, 2021 March, “Electrodeposition of (111)-oriented and nanotwin-doped nanocrystalline Cu with ultrahigh strength for 3D IC application”, Nanotechnology, Vol. 32, 225702. (https://orcid.org/0000-0002-3941-1363)
     

  7. Yi-Hsiang Lai, Manik Chandra Sil, and Chih-Ming Chen* (陳志銘), 2021 March, “Surface composite engineering of polyimide to create amine functionalities for autocatalytic metallization”, Applied Surface Science, Vol. 541, 148500. (https://doi.org/10.1016/j.apsusc.2020.148500)
     

  8. Ping-Chen Chiang, Yu-An Shen*, Shien-Ping Feng, and Chih-Ming Chen* (陳志銘), 2021 January, “Electrodeposition of Twinned Cu with Strong Texture Effect on Voiding Propensity in Electroplated Cu Solder Joints”, Journal of the Electrochemical Society, Vol. 167, 162516. (https://doi.org/10.1149/1945-7111/abd517)

2020

  1. Manik Chandra Sil, Li-Syuan Chen, Chin-Wei Lai, Yu-Hsin Lee, Cheng-Chung Chang*, and Chih-Ming Chen* (陳志銘), 2020 December, “Enhancement of power conversion efficiency of dye-sensitized solar cells for indoor applications by using a highly responsive organic dye and tailoring the thickness of photoactive layer”, Journal of Power Sources, Vol. 479, pp. 229095. (https://doi.org/10.1016/j.jpowsour.2020.229095)
     

  2. Jun-Nan Liu, Manik Chandra Sil, Rui Cheng, Shien-Ping Feng, and Chih-Ming Chen* (陳志銘), 2020 October, “Surface silanization of polyimide for autocatalytic metallization”, JOM, Vol. 72, pp. 3529–3537. (10.1007/s11837-020-04286-2)
     

  3. Manik Chandra Sil, Li-Syuan Chen, Chin-Wei Lai, Cheng-Chung Chang*, and Chih-Ming Chen* (陳志銘), 2020 September, “Enhancement in the solar efficiency of a dye-sensitized solar cell by molecular engineering of an organic dye incorporating N-alkyl-attached 1,8-naphthalamide derivative”, Journal of Materials Chemistry C, Vol. 8, pp. 11407-11416. (DOI: 10.1039/D0TC01388A) (Selected as “Back Cover”)
     

  4. Tzu-Jung Liu, Manik Chandra Sil, and Chih-Ming Chen* (陳志銘), 2020 June, “Well-organized Organosilane Composites for Adhesion Enhancement of Heterojunctions”, Composites Science and Technology, Vol. 193, pp. 108135. (10.1016/j.compscitech.2020.108135)
     

  5. Ping Heng Wu, Yu-Zhong Lai, Yan-Ping Zhang, Manik Chandra Sil, Po-Heng (Henry) Lee, Tzu-Chien Wei*, and Chih-Ming Chen* (陳志銘), 2020 April, “Organosiloxane Monolayers Terminated with Amine Groups as Adhesives for Si Metallization”, ACS Applied Nano Materials, Vol. 3, pp. 3741-3749. (10.1021/acsanm.0c00430)
     

  6. Yi-Hsuan Chen, Yi-Hsiang Lai, Ping Heng Wu, Li-Syuan Chen, Yung-Sen Lin, and Chih-Ming Chen* (陳志銘), 2020 March, “Mutual Intercropping-inspired Co-silanization to Graft Well-oriented Organosilane as Adhesion Promotion Nanolayer for Flexible Conductors”, Journal of Industrial and Engineering Chemistry, Vol. 83, pp. 90-99. (https://doi.org/10.1016/j.jiec.2019.11.017)
     

  7. Jenn-Ming Song*, Po-Jen Wang, Lap-Hong Chan, Chih-Ming Chen (陳志銘), Wen-Fu Ho, and Shih-Yun Chen, 2020 February, “Efficiency Enhancement of Dye-Sensitized Solar Cells Using Ti-Nb Alloy Photoanodes with Mesoporous Oxide Surface”, Journal of The Electrochemical Society, Vol. 167, pp. 046501. (DOI: 10.1149/1945-7111/ab6fef)
     

  8. Po-Fan Chan, Hsuan Lee, Shih-I Wen, Mao-Chun Hung, Chih-Ming Chen (陳志銘), and Wei-Ping Dow*, 2020 February, “Effect of Copper Grain Size on The Interfacial Microstructure of Sn/Cu Joint”, ACS Applied Electronic Materials, Vol. 2, pp. 464-472. (https://doi.org/10.1021/acsaelm.9b00720)
     

  9. Chia-Yuan Chen, Ting-Yang Kuo, Chien-Wu Huang, Zih-Hong Jian, Po-Tsung Hsiao, Chin-Li Wang, Jian-Ci Lin, Chien-Yu Chen, Chao-Hsuan Chen, Yung-Liang Tung, Ming-Chi Tsai, Kuan-Min Huang, Chih-Ming Chen (陳志銘), Cheng-Wei Hsu, Yen-Chiao Chen, Zingway Pei, Yogesh S. Tingare, Hsien-Hsin Chou, Chen-Yu Yeh, Ching-Yao Lin, Yuh-Lang Lee, Hao-Wu Lin, Hsin-Fei Meng, Chun-Guey Wu, and Pi-Tai Chou, 2020 February, “Thermal and angular dependence of next-generation photovoltaics under indoor lighting”, Progress in Photovoltaics: Research and Applications, Vol. 28, pp. 111-121. (DOI: 10.1002/pip.3211).
     

  10. Yu-Wen Chen, Manik Chandra Sil, and Chih-Ming Chen* (陳志銘), 2020 February, “Increasing Solar Light Efficiency by Engineering Cell Structures with Modified Ti Foil and Specific Concentrations of Electrolyte in Liquid Dye-Sensitized Solar Cells”, Electrochimica Acta, Vol. 334, pp. 135631 (https://doi.org/10.1016/j.electacta.2020.135631)
     

  11. Chia-Yu Liu, Po-Cheng Kuo, Chih-Ming Chen (陳志銘), Jia-Ying Dai, Yee-Wen Yen, and Alberto S. Pasana, 2020 January, “Effect of Multiple Reflowing Processes on Interfacial Reactions and Mechanical Properties between Sn-9.0 wt.%Zn, Sn-3.0 wt.%Ag-0.5 wt.%Cu Solders and Ag Substrate”, Journal of Electronic Materials, Vol. 49, pp. 257-267. (https://doi.org/10.1007/s11664-019-07752-z)

2019

  1. Kai-Wen Chen, Li-Syuan Chen, and Chih-Ming Chen*(陳志銘), 2019 August, “Post-treatment of Nb2O5 Compact Layer in Dye-sensitized Solar Cells for Low-level Lighting Applications”, Journal of Materials Science: Materials in Electronics, Vol. 30, pp. 15105-15115. (https://doi.org/10.1007/s10854-019-01883-z)
     

  2. Shan-Ting Tsai, Ping-Chen Chiang, Chang Liu, Shien-Ping Feng, and Chih-Ming Chen*(陳志銘), 2019 September, “Suppression of Void Formation at Sn/Cu joint Due to Twin Formation in Cu Electrodeposit”, JOM, Vol. 71, pp. 3012-3022. (Selected as Journal Cover). (https://doi.org/10.1007/s11837-019-03576-8)
     

  3. Tzu-Jung Liu, Chien-Han Chen, Pei-Yu Wu, Ching-Hsuan Lin*, and Chih-Ming Chen*(陳志銘), 2019 June, “Efficient and Adhesiveless Metallization of Flexible Polyimide by Functional Grafting of Carboxylic Acid Groups”, Langmuir, Vol. 35, pp. 7212-7221. (http://dx.doi.org/10.1021/acs.langmuir.9b00354)
     

  4. Zeyang Zheng, Ping-Chen Chiang, Yu-Ting Huang, Wei-Ting Wang, Po-Chien Li, Ya-Hui Tsai, Chih-Ming Chen*(陳志銘), and Shien-Ping Feng*, 2019 August, “Study of grain size effect of Cu metallization on interfacial microstructures of solder joints”, Microelectronics Reliability, Vol. 99, pp. 44-51. (https://doi.org/10.1016/j.microrel.2019.05.018).
     

  5. Hsuan-Ling Hsu, Hsuan Lee, Chi-Wei Wang, Chenju Liang*, and Chih-Ming Chen*(陳志銘), 2019 March, “Impurity evaporation and void formation in Sn/Cu solder joints”, Materials Chemistry and Physics, Vol. 225, pp. 153-158. (https://doi.org/10.1016/j.matchemphys.2018.12.036)
     

  6. Hsuan Lee, Shan-Ting Tsai, Ping-Heng Wu, Wei-Ping Dow, and Chih-Ming Chen*(陳志銘), 2019 January, “Influence of Additives on Electroplated Copper Films and Their Solder Joints”, Materials Characterization, Vol. 147, pp. 57-63. (https://doi.org/10.1016/j.matchar.2018.10.029)
     

  7. Yee-Wen Yen, William Yu, Chu-Hsuan Wang, Chih-Ming Chen (陳志銘), Yu-Chun Li, Pei-Yu Chen, and Guan-Da Chen, 2019 January, “Study of Interfacial Reactions between Lead-free Solders and Cu-xZn Alloys”, Journal of Electronic Materials, Vol. 48 (1), pp. 170-181. (https://doi.org/10.1007/s11664-018-6577-y)

2018

  1. Hsuan Lee, Yi-An Wang, and Chih-Ming Chen*(陳志銘), 2018 October, “Development of nanotwins in electroplated copper and its effect on shear strength of tin/copper joint”, Journal of Alloys and Compounds, Vol. 765, pp. 335-342. (https://doi.org/10.1016/j.jallcom.2018.06.247)
     

  2. Hsuan-Ling Hsu, Hsuan Lee, Ping-Heng Wu, Yee-Wen Yen, and Chih-Ming Chen*(陳志銘), 2018 August, “Impurity-induced Unusual Microstructural Evolution and Mechanical Property in Sn/Cu Solder Joints”, Journal of Materials Science: Materials in Electronics, Vol. 29 (15), pp. 12842-12849. (https://doi.org/10.1007/s10854-018-9403-7)
     

  3. Yen-Chiao Chen, Ya-Ching Chang, and Chih-Ming Chen*(陳志銘), 2018 July, “The Study of Blocking Effect of Nb2O5 in Dye-sensitized Solar Cells under Low Power Lighting”, Journal of The Electrochemical Society, Vol. 165 (7), pp. F409-F416. (DOI: 10.1149/2.0091807jes)
     

  4. Hsuan Lee and Chih-Ming Chen*(陳志銘), 2018 June, “Impurity Effects in Electroplated-Copper Solder Joints”, Metals, Vol. 8(6), 388. (doi: 10.3390/met8060388).
     

  5. Ying-Chen Chiang, Zi-Lun Lai, Chih-Ming Chen*(陳志銘), Cheng-Chung Chang*, and Bin Liu*, 2018, “Construction of emission-tunable nanoparticles based on a TICT-AIEgen: Impact of aggregation-induced emission versus twisted intramolecular charge transfer”, Journal of Materials Chemistry B, Vol. 6, pp. 2869-2876. (doi: 10.3390/met8060388) (DOI: 10.1039/C8TB00539G).
     

  6. Chih-Hsiang Huang, Yu-Wen Chen, and Chih-Ming Chen*(陳志銘), 2018 March, “Chromatic Titanium Photoanode for Dye-Sensitized Solar Cells under Rear Illumination”, ACS Applied Materials & Interfaces, Vol. 10 (3), pp. 2658-2666. (DOI: 10.1021/acsami.7b18351).
     

  7. Kamani Reddy, Yen-Chiao Chen, Chih-Chung Wu, Chia-Wei, Hsu, Ya-Ching Chang, Chih-Ming Chen*(陳志銘), and Chen-Yu Yeh*, 2018 March, “Co-sensitization of Structurally Simple Porphyrin and Anthracene-based Dye for Dye-Sensitized Solar Cells”, ACS Applied Materials & Interfaces, Vol. 10 (3), pp. 2391-2399. (https://doi.org/10.1021/acsami.7b12960)
     

  8. Gita Novian Hermana, Tzu-Ting Huang, Chih-Ming Chen(陳志銘), Chin-Hung Lin, Satoshi Iikubo, and Yee-Wen Yen*, 2018 February, “Phase Equilibria of the Cu-Ni-Zr Ternary Systems at 800 °C and Thermodynamic Assessment and Metallic Glass Region Prediction for the Cu-Ni-Zr Ternary System”, Journal of Non-Crystalline Solids, Vol. 481: 1, pp. 612-621. (https://doi.org/10.1016/j.jnoncrysol.2017.12.016)
     

  9. Yu-Chen Tseng, Hsuan Lee, Nga Yu Hau, Shien-Ping Feng, and Chih-Ming Chen*(陳志銘), 2018 January, “Electrodeposition of Ni on Bi2Te3 and Interfacial reaction between Sn and Ni-coated Bi2Te3”, Journal of Electronic Materials, Vol. 47 (1), pp. 27-34. (Editor Choice Article). (https://doi.org/10.1007/s11664-017-5777-1)

2017

  1. Yeng-Fong Shih*, Man-Yun Chou, Wen-Chuan Chang, Hong-Yuan Lian, and Chih-Ming Chen(陳志銘), 2017 November, “Completely Biodegradable Composites Reinforced by the Cellulose Nanofibers of Pineapple Leaves Modified by Eco-friendly Methods”, Journal of Polymer Research, Vol. 24: 209, pp. 1-12. (https://doi.org/10.1007/s10965-017-1367-4)
     

  2. Jyun-Wei Chen, Chih-Ming Chen*(陳志銘), and Cheng-Chung Chang*, 2017 September, “A fluorescent pH probe for acidic organelle in living cells”, Organic & Biomolecular Chemistry, Vol. 15, pp. 7936-7943. (   https://doi.org/10.1039/C7OB02037F)
     

  3. Pei-Yu Wu, Ching-Hsuan Lin, and Chih-Ming Chen*(陳志銘), 2017 May, “Study of Surface Metallization of Polyimide Film and Interfacial Characterization”, Metals, Vol. 7, pp. 189 (12 pages). (https://doi.org/10.3390/met7060189)
     

  4. Hsuan Lee, Tai-Yi Yu, Hsi-Kuei Cheng, Kuo-Chio Liu, Po-Fan Chan, Wei-Ping Dow*, and Chih-Ming Chen(陳志銘), 2017 July, “Impurity Incorporation in the Cu Electrodeposit and Its Effects on the Microstructural Evolution of the Sn/Cu Solder Joints”, Journal of The Electrochemical Society, Vol. 164, pp. D457-D462. (DOI: 10.1149/2.1171707jes)
     

  5. Yu-Jie Lin, Jyun-Wei Chen, Po-Tsung Hsiao, Yung-Liang Tung, Cheng-Chung Chang, and Chih-Ming Chen(陳志銘), 2017 April, “Efficiency Improvement of Dye-sensitized Solar Cells by In-situ Fluorescence Resonance Energy Transfer”, Journal of Materials Chemistry A, Vol. 5, pp. 9081-9089. (DOI: 10.1039/C7TA00638A).
     

  6. Chia-Yuan Chen, Zih-Hong Jian, Shih-Han Huang, Kun-Mu Lee, Ming-Hsuan Kao, Chang-Hong Shen, Jia-Min Shieh, Chin-Li Wang, Chiung-Wen Chang, Bo-Zhi Lin, Ching-Yao Lin, Ting-Kuang Chang, Yun Chi, Cheng-Yu Chi, Wei-Ting Wang, Yian Tai, Ming-De Lu, Yung-Liang Tung, Po-Ting Chou, Wen-Ti Wu, Tahsin J. Chow, Peter Chen, Xiang-Hao Luo, Yuh-Lang Lee, Chih-Chung Wu, Chih-Ming Chen(陳志銘), Chen-Yu Yeh, Miao-Syuan Fan, Jia-De Peng, Kuo-Chuan Ho, Yu-Nan Liu, Hsiao-Yi Lee, Chien-Yu Chen, Hao-Wu Lin, Chia-Te Yen, Yu-Ching Huang, Cheng-Si Tsao, Yu-Chien Ting, Tzu-Chien Wei, and Chun-Guey Wu, 2017 April, “Performance Characterization of Dye-Sensitized Photovoltaics Under Indoor Lighting”, Journal of Physical Chemistry Letters, Vol. 8 (8), pp. 1824-1830. (https://doi.org/10.1021/acs.jpclett.7b00515)
     

  7. Yu-Chen Tseng, Hsuan Lee, Shan-Chen Tsai, Yee-Wen Yen, and Chih-Ming Chen(陳志銘), 2017 June, “Suppression Effect of Ni Grain Size on the Ni3Sn4 Growth at the Sn/Ni Interface”, Materials Characterization, Vol. 128, pp. 232-237. (doi.org/10.1016/j.matchar.2017.04.013).
     

  8. Chih-Fan Lin, Nga Yu Hau, Yu-Ting Huang, Ya-Huei Chang, Shien-Ping Feng, Chih-Ming Chen(陳志銘), 2017 June, “Synergetic effect of Bi2Te3 alloys and electrodeposition of Ni for interfacial reactions at solder/Ni/Bi2Te3 joints”, Journal of Alloys and Compounds, Vol. 708, pp. 220-230. (https://doi.org/10.1016/j.jallcom.2017.02.300)

2016

  1. Tai-Yi Yu, Hsuan Lee, Hsuan-Ling Hsu, Wei-Ping Dow, Hsi-Kuei Cheng, Kuo-Chio Liu, and Chih-Ming Chen(陳志銘), October 2016, “Effects of Cu electroplating formulas on the interfacial microstructures of Sn/Cu joints”, Journal of The Electrochemical Society, Vol. 163, pp. D734-741. (DOI: 10.1149/2.0091614jes)
     

  2. Tzu-Ting Huang, Shih-Wei Lin, Chih-Ming Chen(陳志銘), Pei-Yu Chen, and Yee-Wen Yen, December 2016, “Phase Equilibria of the Fe-Ni-Sn Ternary System at 270 °C”, Journal of Electronic Materials, Vol. 45, pp. 6208-6213. (https://doi.org/10.1007/s11664-016-4787-8)
     

  3. Tzu-Hao Wang, Hsuan Lee, Chih-Ming Chen(陳志銘), Ming-Guan Chen, Chi-Chang Hu, Yu-Jie Chen, and Ray-Hua Horng, August 2016, “Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material”, Microelectronics Reliability, Vol. 63, pp. 68-75. (https://doi.org/10.1016/j.microrel.2016.06.012)
     

  4. Ting-Chien Liu, Chih-Chung Wu, Chih-Hsiang Huang, and Chih-Ming Chen(陳志銘), December 2016, “Effects of Ethyl Cellulose on Performance of Titania Photoanode for Dye-sensitized Solar Cells”, Journal of Electronic Materials, Vol. 45, pp. 6192-6199. (https://doi.org/10.1007/s11664-016-4719-7)
     

  5. Kuei-Chang Lai, Pei-Yu Wu, Chih-Ming Chen(陳志銘), Tzu-Chien Wei, Chung-Han Wu, and Shien-Ping Feng, October 2016, “Interfacial characterizations of a nickel-phosphorus layer electrolessly deposited on a silane-compound-modified silicon wafer under thermal annealing”, Journal of Electronic Materials, Vol. 45, pp. 4813-4822. (https://doi.org/10.1007/s11664-016-4708-x)
     

  6. H.-K. Cheng, Y.-J. Lin, C.-M. Chen(陳志銘), K.-C. Liu, Y.-L. Wang, and T.-F. Liu, August 2016, “Microstructural evolution of Cu/solder/Cu pillar-type structures with different diffusion barriers”, Metallurgical and Materials Transactions A, Vol. 47, pp. 3971-3980. (https://doi.org/10.1007/s11661-016-3591-7)
     

  7. H.-M. Hsiao, Y.-W. Chang, C.-M. Chen(陳志銘), P.-Y. Chen, Y.-P. Wu, Y.-W. Yen, July 2016, “Phase equilibria in the Au-Bi-Sn ternary system at temperatures of 80, 125, and 150 °C”, International Journal of Materials Research, Vol. 107, pp. 615-623. (DOI: 10.3139/146.111380)
     

  8. H.-T. Chan, C.-F. Lin, Y.-W. Yen, and C.-M. Chen(陳志銘), May 2016, “Effects of current stressing on the p-Bi2Te3/Sn interfacial reactions”, Journal of Alloys and Compounds, Vol. 668, pp. 91-96. (https://doi.org/10.1016/j.jallcom.2016.01.204)

2015

  1. L.-C. Cheng, C.-M. Chen(陳志銘), M.-G. Chen, C.-C. Hu, H.-Y. Jiang, R.-H. Horng and D.-S. Wuu, 2015 August, “A high-temperature die-bonding structure fabricated at low temperature for light-emitting diodes”, IEEE Electron Device Letters, Vol. 36, pp. 835-837.
     

  2. S. Ye, J.-D. Hwang, and C.-M. Chen(陳志銘), 2015 June, “Strong anisotropic effects of p-type Bi2Te3 element on the Bi2Te3/Sn interfacial reactions”, Metallurgical and Materials Transactions A, Vol. 46, pp. 2372-2375.
     

  3. H.-K. Cheng, Y.-J. Lin, H.-C. Chang, K.-C. Liu, Y.-L. Wang, T.-F. Liu, and C.-M. Chen(陳志銘), 2015 May, “Unusual morphological evolution of the Cu pillar/solder micro-joints during high-temperature annealing”, Metallurgical and Materials Transactions A, Vol. 46, pp. 1834-1837.
     

  4. T.-C. Wei, T.-C. Pan, C.-M. Chen(陳志銘), K.-C. Lai, and C.-H. Wu, 2015 May, “Annealing-free adhesive electroless deposition of nickel/phosphorous layer on silane-compound modified Si wafer”, Electrochemistry Communications, Vol. 54, pp. 6-9.
     

  5. Y.-W. Yen, C.-W. Chiu, C.-M. Chen(陳志銘), M.-T. Lai, and J.-Y. Dai, 2015 March, “Interfacial Reactions in Sn/Ni-xW Couples”, Journal of Electronic Materials, Vol. 44, pp. 909-915.
     

  6. C.-C. Chou, K.-Y. Tsao, C.-C. Wu, H. Yang, and C.-M. Chen(陳志銘), 2015 February, “Improved power conversion efficiency for dye-sensitized solar cells using a subwavelength-structured antireflective coating”, Applied Surface Science, Vol. 328, pp. 198-204.
     

  7. H.-K. Cheng, C.-W. Huang, H. Lee, Y.-L. Wang, T.-F. Liu, and C.-M. Chen(陳志銘), 2015 February, “Interfacial Reactions between Cu and SnAgCu solder doped with minor Ni”, Journal of Alloys and Compounds, Vol. 622, pp. 529-534.
     

  8. T.-K. Yang, C.-F. Lin, and C.-M. Chen(陳志銘), 2015 January, “Interfacial Reactions between Cu-Ag alloy substrates and Sn”, Journal of Electronic Materials, Vol. 44, pp. 511-517.
     

  9. Y.-J. Lin, C.-C. Chang, S.-J. Cherng, J.-W. Chen, and C.-M. Chen(陳志銘), 2015 January, “Manipulation of light harvesting for efficient dye-sensitized solar cell by doping an ultraviolet light-capturing fluorophore”, Progress in Photovoltaics: Research and Applications, Vol. 23, pp. 106-111.

2014

  1. C.-F. Lin, C.-M. Chen(陳志銘), W.-P. Dow, H.-H. Liu, H.-C. Tien, S.-F. Lee, and W.-M. Chen, 2014 October, "Intermetallic Compound Formation and Mechanical Property of Inner Lead Bonding Joints", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 4, pp. 1739-1744.
     

  2. J.-Y. Wu, H. Lee, C.-H. Wu, C.-F. Lin, W.-P. Dow, and C.-M. Chen(陳志銘), 2014 October, "Effects of Electroplating Additives on the Interfacial Reactions between Sn and Cu Electroplated Layers", Journal of The Electrochemical Society, Vol. 161, pp. D522-D527.
     

  3. F.-C. Hsu, Y.-C. Cheng, Y.-T. Wang, M.-T. Lin, C.-M. Chen(陳志銘), 2014 June-July, "Planar copper-tin intermetallic film formation on strained substrates", Microelectronics Reliability, Vol. 54, pp. 1378-1383.
     

  4. Y.-H. Chang, Y.-T. Huang, M.-K. Lo, C.-F. Lin, C.-M. Chen(陳志銘), S.-P. Feng, 2014 June, "Electrochemical Fabrication of Transparent Nickel Hydroxide Nanostructures with Tunable Superhydrophobicity/Superhyrophilicity for 2D Microchannels Application", Journal of Materials Chemistry A, Vol. 2, pp. 1985-1990.
     

  5. P.-K. Chuang, Y.-J. Lin, C.-M. Chen(陳志銘), and C.-C. Chang, 2014 June, "Improved power conversion efficiency of dye-sensitized solar cells by fluorophore-assisted spectrum down-conversion", Journal of The Electrochemical Society, Vol. 161, pp. H404-H409.
     

  6. C.-P. Lin, C.-M. Chen(陳志銘) and Y.-W. Yen, 2014 April, "Enhanced growth of the Cu6Sn5 phase in the Sn/Ag/Cu and Sn/Cu multilayers subjected to applied strain", Journal of Alloys and Compounds, Vol. 591, pp. 297-303.
     

  7. F. Xie, S.-J. Cherng, S. Lu, Y.-H. Chang, W. Sha, S.-P. Feng, C.-M. Chen(陳志銘), W. Choy, 2014 March, "The Functions of Self-assembled Ultrafine TiO2 Nanocrystals for High Efficient Dye-Sensitized Solar Cells", ACS Applied Materials & Interfaces, Vol. 6, pp. 5367-5373.
     

  8. H.-K. Cheng, S.-P. Feng, Y.-J. Lai, K.-C. Liu, Y.-L. Wang, T.-F. Liu, and C.-M. Chen(陳志銘), 2014 March, "Effect of Polyimide Baking on Bump Resistance in Flip-Chip Solder Joints", Microelectronics Reliability, Vol. 54, pp. 629-632.
     

  9. H.-F. Ting, C.-M. Chen(陳志銘), F.-H. Lu, S.-Y. Suen, 2014 March, "Adsorption and photodegradation of methylene blue using a bulk Ti material with porous titania layer prepared by chemical oxidation", Journal of the Taiwan Institute of Chemical Engineers, Vol. 45, pp. 617-624.
     

  10. Y.-W. Yen, R.-S. Syu, C.-M. Chen(陳志銘), C.-C. Jao, G.-D. Chen, 2014 January, "Interfacial Reactions of Sn-58Bi and Sn-0.7Cu Lead-free Solders with Alloy42 Substrate Microelectronics Reliability", Microelectronics Reliability, Vol. 54, pp. 233-238.
     

  11. J.-Y. Wang, C.-M. Chen(陳志銘), and Y.-W. Yen, 2014 January, "Interfacial reactions of high-Bi alloys on various substrates", Journal of Electronic Materials, Vol. 43, pp. 155-165.

2013

  1. C.-Y. Hsu, S.-J. Cherng, Y.-J. Lin and C.-M. Chen(陳志銘), 2013 November, “A Compact Nano-TiO2 Underlayer for Efficient Dye-sensitized Solar Cell”, IEEE Electron Device Letters, Vol. 34, pp. 1415-1417.
     

  2. Y.-T. Huang, Y.-Y. Zhan, S.-J. Cherng, C.-M. Chen(陳志銘), S.-P. Feng, T.-C. Wei, 2013 September, "Surface metallization of polyimide as a photoanode substrate for rear-illuminated dye-sensitized solar cells", Journal of The Electrochemical Society, Vol. 160, H581-H586.
     

  3. Y.-T. Huang, S.-P. Feng, and C.-M. Chen(陳志銘), 2013 June, “Nickel Substrate covered with a Sn-based Protection Bi-layer as a Photoanode Substrate for Dye-sensitized Solar Cells”, Electrochimica Acta, Vol. 99, pp. 230-237.
     

  4. T.-Y. Tsai, C.-M. Chen(陳志銘), S.-J. Cherng, and S.-Y. Suen, 2013 March, “An efficient titanium-based photoanode for dye-sensitized solar cell under back-side illumination”, Progress in Photovoltaics: Research and Applications, Vol. 21, pp. 226-231.
     

  5. C.-P. Lin and C.-M. Chen(陳志銘), 2013 January, “The cross-interactions in the Ni/Sn/Cu diffusion couples with an electroless palladium surface finish”, Journal of Alloys and Compounds, Vol. 547, pp. 37-42.
     

  6. J.-Y. Wu, C.-M. Chen(陳志銘), R.-H. Horng, and D.-S. Wuu, 2013 January, “An efficient metal-core printed-circuit board with a copper-filled through (blind) hole for light-emitting diodes”, IEEE Electron Device Letters, Vol. 34, pp. 105-107.
     

  7. P.-H. Lee, C.-P. Lin, and C.-M. Chen(陳志銘), 2013 January, “Retardation of the Cu5Zn8 phase fracture and improvement of shear strength of the Sn-9 wt.% Zn/Cu interface by inserting an electroless Palladium layer”, Metallurgical and Materials Transactions A, Vol. 44A, pp. 125-130.

2012

  1. T.-C. Wei, S.-P. Feng, Y.-H. Chang, S.-J. Cherng, Y.-J. Lin, C.-M. Chen(陳志銘), H.-H. Chen, 2012 December, “Fabrication and Characterization of Interconnected Grid-type Dye-Sensitized Solar Modules”, International Journal of Electrochemical Science, Vol. 7, pp. 11904-11916.
     

  2. J.-Y. Wang, C.-F. Lin, and C.-M. Chen(陳志銘), 2012 December, “Interfacial reactions and mechanical properties of the Bi-x wt.% Sn/Cu joints (x= 2, 5, and 10)”, Journal of Electronic Materials, Vol. 41, pp. 3303-3308.
     

  3. H.-A. Pan, C.-P. Lin, and C.-M. Chen(陳志銘), 2012 September, “Interfacial reaction of molten Sn on a strained Cu electroplated layer”, Journal of Electronic Materials, Vol. 41, pp. 2470-2477.
     

  4. C.-F. Lin, S.-H. Lee, and C.-M. Chen(陳志銘), 2012 August, “Effect of Sn grain orientation on the Cu6Sn5 formation in a Sn-based solder under current stressing”, Metallurgical and Materials Transactions A, Vol. 43A, pp. 2571-2573.
     

  5. B.-H. Liou, C.-M. Chen(陳志銘), R.-H. Horng, Y.-C. Chiang, and D.-S. Wuu, 2012 May, ”Improvement of thermal management of high-power GaN-based light-emitting diodes”, Microelectronics Reliability, Vol. 52, pp. 861-865.
     

  6. C.-P. Lin and C.-M. Chen(陳志銘), 2012 February, “Solid-state interfacial reactions at the solder joints employing Ni/Pd/Au and Ni/Au as the surface finish metallizations”, Microelectronics Reliability, Vol. 52, pp. 385-390.

2011

  1. W.-K. Liao, C.-M. Chen(陳志銘), M.-T. Lin, C.-H. Wang, 2011 October, “Enhanced growth of the Ni3Sn4 phase at the Sn/Ni interface subjected to strains”, Scripta Materialia, Vol. 65, pp. 691-694.
     

  2. S.-H. Lee and C.-M. Chen(陳志銘), 2011 September, “Electromigration in a Sn-3wt.%Ag-0.5wt.%Cu-3wt.%Bi solder stripe between two Cu electrodes under current stressing”, Journal of Electronic Materials, Vol. 40, pp. 1943-1949.
     

  3. S.-J. Cherng, C.-M. Chen(陳志銘), W.-P. Dow, C.-H. Lin, and S.-W. Chen, 2011 July, “Chemical deposition of Ni/Pt bi-layer on polyimide film as flexible counterelectrodes for dye-sensitized solar cells”, Electrochemical and Solid State Letters, Vol. 14, P13-P15.
     

  4. Y.-T. Huang, Y.-W. Lin, and C.-M. Chen(陳志銘), 2011 May, “Characterization of carbon nanomaterials synthesized from thermal decomposition of paper phenolic board”, Materials Chemistry and Physics, Vol. 127, pp. 397-404.
     

  5. J.-L. Lan, C.-C. Wan, T.-C. Wei, W.-C. Hsu, C. Peng, Y.-H. Chang, and C.-M. Chen(陳志銘), 2011 May, “Improvement of Photovoltaic Performance of Dye-Sensitized Solar Cell by Post Heat Treatment of Polymer-Capped Nano-Platinum Counterelectrode”, International Journal of Electrochemical Science, Vol. 6, pp. 1230-1236.
     

  6. J.-Y. Wang, C.-F. Lin, and C.-M. Chen(陳志銘), 2011 April, “Retarding the Cu5Zn8 phase fracture at the Sn-9 wt.% Zn/Cu interface”, Scripta Materialia, Vol. 64, pp. 633-636.
     

  7. C.-M. Chen(陳志銘), Y.-C. Hsu, and S.-J. Cherng, 2011 January, “Effects of annealing conditions on the properties of TiO2/ITO-based photoanode and the photovoltaic performance of dye-sensitized solar cells”, Journal of Alloys and Compounds, Vol. 509, pp. 872-877.

2010

  1. C.-J. Chen, C.-M. Chen(陳志銘), R.-H. Horng, D.-S. Wuu, and J.-S. Hong, 2010 December, “Thermal management and interfacial properties in high-power GaN-based light-emitting diodes employing diamond-added Sn-3wt.%Ag-0.5wt.%Cu solder as die attach materials”, Journal of Electronic Materials, Vol. 39, pp. 2618-2626.
     

  2. C.-M. Chen(陳志銘), C.-H. Chen, S.-J. Cherng, and T.-C. Wei, 2010 November, “Electroless deposition of platinum on indium tin oxide glass as the counterelectrode for dye-sensitized solar cells”, Materials Chemistry and Physics, Vol. 124, pp. 173-178.
     

  3. J.-S. Hong, R.-H. Horng*, Y.-L. Tsai, D.-S. Wuu, C.-M. Chen(陳志銘), and C.-J. Chen, 2010 September, “Optimized Thermal Management from Chip to Heat Sink for High-Power GaN-Based Light-Emitting Diodes”, IEEE Transactions on Electron Devices, Vol. 57, pp. 2203-2207.
     

  4. S.-J. Cherng, Y.-C. Hsu, and C.-M. Chen(陳志銘), 2010 September, “Mitigation of Solvent Evaporation in Dye-Sensitized Solar Cells Based on Liquid Electrolyte by Introducing Regular-fencing-patterned Polymer Films”, Journal of the Chinese Institute of Engineers, Vol. 33, pp. 791-797.
     

  5. C.-P. Lin, C.-M. Chen(陳志銘), C.-H. Lin, and W.-C. Su, 2010 July, “Interfacial reactions of Sn/Ag/Cu tri-layer on a deformed polyimide substrate”, Journal of Alloys and Compounds, Vol. 502, pp. L17-L19.
     

  6. Y.-W. Lin, P.-Y. Shih, and C.-M. Chen(陳志銘), 2010 March, “A current-induced localized heating technique for fabrication of carbon nanomaterials”, Journal of Alloys and Compounds, Vol. 492, pp. 521-524.
     

  7. C.-M. Chen(陳志銘), C.-H. Chen, and T.-C. Wei, 2010 February, “Chemical deposition of platinum on metallic sheets as counterelectrodes for dye-sensitized solar cells”, Electrochimica Acta, Vol. 55, pp. 1687-1695.

2009

  1. C.-M. Chen(陳志銘), H.-S. Shiu, S.-J. Cherng, and T.-C. Wei, MAR 2009, “Preparation of polymer film of micro-porous or island-like structure and its application in dye-sensitized solar cell”, Journal of Power Sources, Vol. 188, pp. 319-322.
     

  2. H.-M. Chung, C.-M. Chen(陳志銘), C.-P. Lin, and C.-J. Chen, OCT 2009, “Microstructural Evolution of the Au-20 wt.% Sn Solder on the Cu Substrate During Reflow”, Journal of Alloys and Compounds, Vol. 485, pp. 219-224.
     

  3. C.-P. Lin and C.-M. Chen(陳志銘), JUN 2009, “Intermetallic compound formation and evolution in the solid-state Sn/immersion-Ag/Cu tri-layer interfacial reactions on a flexible polymer board”, Journal of Electronic Materials, Vol. 38, pp. 908-914.
     

  4. C.-M. Chen(陳志銘) and Y.-J. Chen, JUL 2009, “Growth orientation of the tin whiskers on an electrodeposited Sn layer under three-point bending”, Materials Letters, Vol. 63, pp. 1517-1520.
     

  5. C.-M. Chen(陳志銘), Y.-M. Hung, and C.-H. Lin, MAY 2009, “Electromigration of Sn-8 wt.% Zn-3 wt.% Bi and Sn-9 wt.% Zn-1 wt.% Cu solders”, Journal of Alloys and Compounds, Vol. 475, pp. 238-244.
     

  6. C.-M. Chen(陳志銘), Y.-M. Hung, C.-P. Lin, and W.-C. Su, MAY 2009, “Effect of temperature on microstructural changes of the Sn-9 wt.% Zn lead-free solder stripe under current stressing”, Materials Chemistry and Physics, Vol. 115, pp. 367-370.
     

  7. Y.-J. Chen and C.-M. Chen(陳志銘), MAR 2009, “Mitigative tin whisker growth under mechanically applied tensile stress”, Journal of Electronic Materials, Vol. 38, pp. 415-419.
     

  8. C.-M. Chen(陳志銘), P.-Y. Shih, and Y.-W. Lin, JAN 2009, “Synthesis of nanostructured carbon materials on a tin thin film using phenol formaldehyde as the carbon source”, Journal of Electronic Materials, Vol. 38, pp. 193-199.
     

  9. C.-H. Chen, C.-P. Lin, and C.-M. Chen(陳志銘), JAN 2009, “Effect of Cu thickness on the evolution of the reaction products at the Sn-9 wt.% Zn solder/Cu interface during reflow”, Journal of Electronic Materials, Vol. 38, pp. 61-69.

2008

  1. C.-M. Chen(陳志銘) and P.-Y. Shih, 2008, “A peculiar composite structure of carbon nanofibers growing on a micro-sized tin whisker”, Journal of Materials Research, Vol. 23(10), pp. 2668-2673.
     

  2. C.-M. Chen(陳志銘), C.-H. Chen, and C.-P. Lin, and W.-C. Su, 2008, “Morphological evolution of reaction product at Sn-9 wt.% Zn/thin-film Cu interface”, Journal of Electronic Materials, Vol. 37(10), pp. 1605-1610.
     

  3. C.-M. Chen(陳志銘) and C.-C. Huang, 2008, “Effects of silver doping on electromigration of eutectic SnBi solder”, Journal of Alloys and Compounds, Vol. 461, pp. 235-241.
     

  4. Y.-M. Hung and C.-M. Chen(陳志銘), 2008, “Electromigration of Sn-9 wt.% Zn solder”, Journal of Electronic Materials, Vol. 37, pp. 887-893.
     

  5. C.-M. Chen(陳志銘) and C.-C. Huang, 2008, “Atomic migration in eutectic SnBi solder alloy due to current stressing”, Journal of Materials Research, Vol. 23, pp. 1051-1056.

2007

  1. C.-M. Chen(陳志銘) and C.-H. Chen, 2007, “Interfacial reactions between eutectic SnZn solder and bulk or thin-film Cu substrates”, Journal of Electronic Materials, Vol. 36(10), pp. 1363-1371.
     

  2. C.-M. Chen(陳志銘), C.-C. Huang, C.-N. Liao, and K.-M. Liou, 2007, “Effects of copper doping on microstructural evolution in eutectic SnBi solder stripes under annealing and current stressing”, Journal of Electronic Materials, Vol. 36, pp. 760-765.
     

  3. T.-C. Wei, C.-C. Wan, Y.-Y. Wang, C.-M. Chen(陳志銘), and H.-S. Shiu, 2007, “Immobilization of poly (N-vinyl-2-pyrrolidone)-capped platinum nano-clusters on indium-tin oxide glass and its application in dye-sensitized solar cells”, Journal of Physical Chemistry C, Vol. 111, pp. 4847-4853.
     

  4. C.-M. Chen(陳志銘), K.-Z. Wang, and K.-C. Chen, 2007, “Isothermal solid-state aging of Pb-5Sn solder bump on Ni/Cu/Ti under bump metallization”, Journal of Alloys and Compounds, Vol. 432, pp. 122-128.
     

  5. C.-M. Chen(陳志銘), L.-T. Chen, and Y.-S. Lin, 2007, “Electromigration-induced Bi segregation in eutectic SnBi solder joint”, Journal of Electronic Materials, Vol. 36(2), pp. 168-172.

2006

  1. C.-M. Chen(陳志銘) and H.-C. Lin, 2006, “Interfacial reactions and mechanical properties of ball-grid-array solder joints using Cu-cored solder balls”, Journal of Electronic Materials, Vol. 35, pp. 1937-1947.
     

  2. L.-T. Chen and C.-M. Chen(陳志銘), 2006, “Electromigration study in the eutectic SnBi solder joint on the Ni/Au metallization”, Journal of Materials Research, Vol. 21(4), pp. 962-969.

2005

  1. K.-Z. Wang and C.-M. Chen(陳志銘), 2005, “Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with the Ti/Cu/Ni under bump metallization during reflow soldering”, Journal of Electronic Materials, Vol. 34(12), pp. 1543-1549.

2003

  1. M.-Y. Du, C.-M. Chen(陳志銘), S.-W. Chen, 2003, “Effects upon interfacial reactions by electric currents of reversing directions”, Materials Chemistry and Physics, Vol. 82, pp. 818-825.
     

  2. C.-M. Chen(陳志銘) and S.-W. Chen, 2003, “Electromigration effects upon the low-temperature Sn/Ni interfacial reactions”, Journal of Materials Research, Vol. 18(6), pp. 1293-1296.
     

  3. J.-I. Lee, S.-W. Chen, H.-Y. Chang and C.-M. Chen(陳志銘), 2003, “Reactive Wetting between Molten Sn-Bi and Ni Substrate”, Journal of Electronic Materials, Vol. 32(3), pp. 117-122.
     

  4. S.-W. Chen and C.-M. Chen(陳志銘), 2003, “Electromigration Effects upon Interfacial Reactions”, JOM, Vol. 55(2), pp. 62-67.

2002

  1. C.-M. Chen(陳志銘) and S.-W. Chen*, 2002, “Electromigration Effect upon the Sn/Ag and Sn/Ni Interfacial Reactions at Various Temperatures”, Acta Materialia, Vol. 50, pp. 2461-2469.

2001

  1. C.-M. Chen(陳志銘) and S.-W. Chen*, 2001, “Electromigration Effect upon the Sn-0.7wt%Cu/Ni and Sn-3.5wt%Ag/Ni Interfacial Reactions”, Journal of Applied Physics, Vol. 90(3), pp.1208-1214.

2000

  1. C.-M. Chen(陳志銘)and S.-W. Chen*, 2000, “Electromigration Effect upon the Zn/Ni and Bi/Ni Interfacial Reactions”, Journal of Electronic Materials, Vol. 29(10), pp. 1222-1228.
     

  2. S.-W. Chen, C.-S. Ho, C.-H. Lin and C.-M. Chen(陳志銘), 2000, “The 900℃ Isothermal Section of Ti-Ni-V Alloys”, Metallurgical and Materials Transactions A, Vol. 31A, pp. 1679-1682.

1999

  1. C.-M. Chen(陳志銘) and S.-W. Chen*, 1999, “Electric Current Effects on Sn/Ag Interfacial Reactions”, Journal of Electronic Materials, Vol. 28(7), pp. 902-906.

1998

  1. S.-W. Chen, C.-C. Lin and C.-M. Chen(陳志銘), 1998, “Determination of the Melting and Solidification Characteristics of Solders Using Differential Scanning Calorimetry”, Metallurgical and Materials Transactions A, Vol. 29A, pp. 1965-1972.
     

  2. S.-W. Chen, C.-M. Chen(陳志銘), and W.-C. Liu, 1998, “Electric Current Effects upon the Sn/Cu and Sn/Ni Interfacial Reactions”, Journal of Electronic Materials, Vol. 27(11), pp. 1193-1198.
     

  3. W.-C. Liu, S.-W. Chen*, and C.-M. Chen(陳志銘), 1998, “The Al/Ni Interfacial Reactions under the Influence of Electric Current”, Journal of Electronic Materials, Vol. 27(1), pp. L5-L8.

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