top of page

2025

  1. Zi-Yu Huang, Yen-Ju Chu, Cheng-En Ho, Yu-An Shen, and Chih-Ming Chen (陳志銘), Interfacial reaction and thermomigration of copper/indium joints, Journal of Materials Research and Technology, Vol. 34, pp. 2051-2059 (2025). (https://doi.org/10.1016/j.jmrt.2024.12.227 )
     

  2. Yu-Hsuan Chen, Chao-Fang Huang, Ting-Yu Lo, Manik Chandra Sil, and Chih-Ming Chen (陳志銘), Photocurrent enhancement in dye-sensitized solar cells by polyimide covalent organic frameworks decorated with silver nanoparticles, Journal of Photochemistry & Photobiology, A: Chemistry, Vol. 459, 116052 (2025). (https://doi.org/10.1016/j.jphotochem.2024.116052 )
     

  3. Wei-Li Wang, Sheng-Jye Cherng, Yu-Ting Huang, Runhua Gao, Hiroaki Tatsumi, Hiroshi Nishikawa, and Chih-Ming Chen (陳志銘), Low-temperature soldering using Sn/Bi electrodeposited bilayer, Materials Science in Semiconductor Processing, Vol. 186, 109056 (2025). (https://doi.org/10.1016/j.mssp.2024.109056 )
     

  4. Chan-Ying Lin, Minho Oh, Equo Kobayashi, Chih-Ming Chen (陳志銘), and Yu-An Shen, Investigating Microstructure and Interfacial Stability of Bi-Enhanced Sn-9Zn Alloy on Electroplated Cu during Aging, Materials Science in Semiconductor Processing, Vol. 186, 109046 (2025). (https://doi.org/10.1016/j.mssp.2024.109046 )
     

  5. Chandrasekaran Pitchai, and Chih-Ming Chen (陳志銘), Electrochemically Enhanced Oxygen Evolution and Urea Oxidation Reactions with Advanced High-Entropy LDH Nanoneedles, Sustainable Energy & Fuels, Vol. 9, 1829-1838 (2025). (https://doi.org/10.1039/D5SE00054H )
     

  6. Yue Li, Yu-Ju Li, Man-Hsuan Chung, and Chih-Ming Chen (陳志銘), Microstructures of Sn-5Sb/Sn-58Bi mixed solder and its interfacial reaction with copper, Journal of Materials Science: Materials in Electronics, Vol. 36, 469 (2025). (https://doi.org/10.1007/s10854-025-14541-4 )
     

  7. Pei-Chia Hsu, Zhao-Yu Yang, Chi Lee, and Cheng-En Ho, Chih-Ming Chen (陳志銘), and Yu-An Shen, Pinhole formation and its mitigation for Cu electrodeposition on the Ajinomoto build-up film (ABF) with different surface roughnesses, Journal of Materials Research and Technology, Vol. 36, pp. 193-202 (2025). (https://doi.org/10.1016/j.jmrt.2025.03.100 )

2024

  1. Chandrasekaran Pitchai, Sethuraman Mathur Gopalakrishnan, and Chih-Ming Chen (陳志銘), Ultra-efficient nitrogen-doped carbon dots-supported nickel sulfide as a platinum-free electrocatalyst for overall water splitting in basic medium, Energy & Fuels, Vol. 38, 2235-2247 (2024). (https://doi.org/10.1021/acs.energyfuels.3c03743 )
     

  2. Andromeda Dwi Laksono, Chih-Ming Chen (陳志銘), and Yee-Wen Yen, Interfacial Reactions in the Sn-9.0 wt.% Zn/Cu-Ti Alloy (C1990 HP) Couple, Soldering & Surface Mount Technology, Vol. 36, pp. 30-38 (2024). (https://doi.org/10.1108/SSMT-05-2023-0027 )
     

  3. Ting-An Chen, Ting Yu, Van Truc Vu, Chun-Jen Huang, and Chih-Ming Chen (陳志銘), Silatrane-Based Molecular Nanolayers as Efficient Diffusion Barriers for Cu/SiO2/Si Heterojunctions: Implications for Integrated-Circuit Manufacturing, ACS Applied Nano Materials, Vol. 7, pp. 4874-4885 (2024). (https://doi.org/10.1021/acsanm.3c05604 )
     

  4. Kun-Lin Tsai, Chih-Ming Chen (陳志銘), and Cheng-En Ho, Synergistic effects of additives on impurity residues in high-speed copper electrodeposition and voiding propensity in solder joints, Journal of the Taiwan Institute of Chemical Engineers, Vol. 156, 105391 (2024). (https://doi.org/10.1016/j.jtice.2024.105391 )
     

  5. Yi-Han Wang, Chih-Hsuan Lu, Po-Cheng Chou, Bei-En Wu, Manik Chandra Sil, and Chih-Ming Chen (陳志銘), Synergistic effect of metal cation and 1-dimethylamino-2-propanol on copper corrosion protection in alkaline solution, Journal of the Taiwan Institute of Chemical Engineers, Vol. 156, 105322 (2024). (https://doi.org/10.1016/j.jtice.2023.105322 )
     

  6. Manik Chandra Sil, Sonali Yadav, Ting-An Chen, Chandrasekaran Pitchai, and Chih-Ming Chen (陳志銘), Effects of molecular assembly on heterogeneous interactions in electronic and photovoltaic devices, Chemical Physics Reviews, Vol. 5, 011301 (2024). (https://doi.org/10.1063/5.0173972 )
     

  7. Yu-An Shen, Chan-Ying Lin, and Chih-Ming Chen (陳志銘), Exploring Mechanism of Suppressing Void Formation at Interface of Sn-9Zn and Cu, Journal of Materials Science: Materials in Electronics, Vol. 35, 778 (2024). (https://doi.org/10.1007/s10854-024-12558-9 )
     

  8. Yu-Ju Li, Yee-Wen Yen, and Chih-Ming Chen (陳志銘), Comparative Study of the Impurity Effect on the SnAgCu and SnZn Solder Joints with Electrodeposited Cu, Materials, Vol. 17, 2149 (2024). (https://doi.org/10.3390/ma17092149 )
     

  9. Yu-Hsun Chang, Yu-Ming Lin, Cheng-Yu Lee, Pei-Chia Hsu, Chih-Ming Chen (陳志銘), and Cheng-En Ho, Through glass via (TGV) copper metallization and its microstructure modification, Journal of Materials Research and Technology, Vol. 31, pp. 1008-1016 (2024). (https://doi.org/10.1016/j.jmrt.2024.06.137 )
     

  10. Chandrasekaran Pitchai, Mahalakshmi Vedanarayanan, Chih-Ming Chen (陳志銘), and Sethuraman Mathur Gopalakrishnan, Enhanced Electrochemical Efficiency of the Open Porous Sandrose Structured Electrocatalyst for Sustainable Hydrogen and Oxygen Evolution Reactions, International Journal of Hydrogen Energy, Vol. 72, pp. 755-763 (2024). (https://doi.org/10.1016/j.ijhydene.2024.05.422 )
     

  11. Wei-Yen Wang, Vidya Kattoor, Pei-Qing Yang, Pei-Tsen Wei, Yan-Ping Zhang, Chih-Ming Chen (陳志銘), and Tzu-Chien Wei, A Healable Amino Silane Self-Assembled Monolayer Incorporating Polymer Capped Palladium Nanoclusters and its application as the Copper Diffusion Barrier Layer on Silicon Wafer, Next Materials, Vol. 4, 100218 (2024). (https://doi.org/10.1016/j.nxmate.2024.100218 )
     

  12. Mahalakshmi Vedanarayanan, Chih-Ming Chen (陳志銘), and Mathur Gopalakrishnan Sethuraman, Efficient Hydrogen and Oxygen Evolution: Dual-Functional Electrocatalyst of Zinc Iron Layered Double Hydroxides and Nickel Cobalt Sulfides on Nickel Foam for Seawater Splitting ACS Applied Energy Materials, Vol. 7, 7260-7271 (2024). (https://doi.org/10.1021/acsaem.4c01290 )
     

  13. Mahalakshmi Vedanarayanan, Chandrasekaran Pitchai, Chih-Ming Chen (陳志銘), and Sethuraman Mathur Gopalakrishnan, Electrochemical Oxidation of Seawater using Vanadium Facilitated Quaternary Layered Double Hydroxides Integrated with Sulfur Doped Carbon Dots, Electrochimica Acta, Vol. 497, 144529 (2024). (https://doi.org/10.1016/j.electacta.2024.144529 )
     

  14. Pin-Yu Huang, Man-Hsuan Chung, Jhih-Jhu Jhan, Byungil Hwang, and Chih-Ming Chen (陳志銘), Strong grain size effect on the liquid/solid reactions between molten solder and electroplated Cu, Materials Today Communications, Vol. 41, 110236 (2024). (https://doi.org/10.1016/j.mtcomm.2024.110236 )
     

  15. Heebo Ha, Byunghoon Lee, Sooyong Choi, Nadeem Qaiser, Sera Kwon, Zungsun Choi, Chih-Ming Chen (陳志銘), and Byungil Hwang, Engineering of Uniform Anisotropic Interconnection System with Polyimide Films for Flexible Electronics, Ain Shams Engineering Journal, Vol. 15, 103064 (2024). (https://doi.org/10.1016/j.asej.2024.103064 )
     

  16. Yu-Hsuan Lo, Yu-Hsuan Chen, Chao-Fang Huang, Chandrasekaran Pitchai, Wen-Shiuan Liu, Cheng-Chung Chang, and Chih-Ming Chen (陳志銘), A composite electrocatalytic poly(3,4-ethylenedioxythiophene) film incorporated with silver nanowires for bifacial dye-sensitized solar cells, Electrochimica Acta, Vol. 507, 145132 (2024). (https://doi.org/10.1016/j.electacta.2024.145132 )

2023

  1. Yu-Jyun Kao, Yu-Ju Li, Yu-An Shen, and Chih-Ming Chen (陳志銘), Significant Hall–Petch effect in micro-nanocrystalline electroplated copper controlled by SPS concentration, Scientific Reports, Vol. 13, 428 (2023). (https://doi.org/10.1038/s41598-023-27669-2 )​​
     

  2. Ya-Chung Hsu, Manik Chandra Sil, Ching-Hsuan Lin ,and Chih-Ming Chen (陳志銘), Modification of covalent organic framework by hydrolysis for efficient and selective removal of organic dye, Applied Surface Science, Vol. 612, 155890 (2023). (https://doi.org/10.1016/j.apsusc.2022.155890 )
     

  3. Andromeda Dwi Laksono, Lutfi Yunus Wahab Al-Audhah, Chih-Ming Chen (陳志銘), Yu Xuan Ho, and Yee-Wen Yen, Solid/Solid State Interfacial Reactions in the Sn-9Zn/Cu-Based Alloys (C1990 HP, Alloy 25, and C194) Couples, JOM, Vol. 75, pp. 1889-1901 (2023). (https://doi.org/10.1007/s11837-023-05827-1 )
     

  4. You-Jhen Su, Kun-Lin Tsai, Yu-Ju Li, and Chih-Ming Chen (陳志銘), Effects of suppressors on the incorporation of impurities and microstructural evolution of electrodeposited Cu solder joints, Journal of the Taiwan Institute of Chemical Engineers, Vol. 149, 104956 (2023). (https://doi.org/10.1016/j.jtice.2023.104956 )
     

  5. Jia-Yi Lee, Yu-An Shen, and Chih-Ming Chen (陳志銘), Void-Free Interface between In and High-Impurity Cu Joint, Science and Technology of Welding and Joining, Vol. 28, 983-991 (2023). (https://doi.org/10.1080/13621718.2023.2259720 )
     

  6. Li-Chi Huang, Jenn-Ming Song, and Chih-Ming Chen (陳志銘), Effects of initial Cu grain size and impurity residues on the liquid phase reactions between molten solder and electroplated Cu, Materials Characterization, Vol. 206, 113459 (2023). (https://doi.org/10.1016/j.matchar.2023.113459 )

2022

  1. Jia-Yi Lee, Chih-Ming Chen* (陳志銘), 2022 July, “Effects of Initial Morphology on Growth Kinetics of Cu6Sn5 at SAC305/Cu Interface During Isothermal Aging”, Materials, Vol. 15, 4751. (https://doi.org/10.3390/ma15144751 )
     

  2. Hong-Da Chang, Bei-En Wu, Manik Chandra Sil, Zong-Hao Yang, and Chih-Ming Chen* (陳志銘), 2022 August, “Study of synergy of monoethanolamine and urea on copper corrosion inhibition in alkaline solution”, Journal of Molecular Liquids, Vol. 359, 119344. (https://doi.org/10.1016/j.molliq.2022.119344 )
     

  3. Li-Chi Huang, Yan-Ping Zhang, Chih-Ming Chen* (陳志銘), Liang-Yih Hung, Yu-Po Wang, 2022 June, “Interfacial reactions between pure indium solder and Au/Ni metallization”, Journal of Materials Science: Materials in Electronics, Vol. 33, pp.13143-13151.  (https://doi.org/10.1007/s10854-022-08253-2 )
     

  4. Pei-Hsuan Chang, Manik Chandra Sil, Kamani Sudhir K. Reddy, Ching-Hsuan Lin, and Chih-Ming Chen* (陳志銘), 2022 May, “Polyimide-based covalent organic framework as a photocurrent enhancer for efficient dye-sensitized solar cells”, ACS Applied Materials & Interfaces, Vol. 14, pp. 25466–25477. (https://doi.org/10.1021/acsami.2c04507 )
     

  5. Po-Kai Chen, Yu-Ju Li, Yee-Wen Yen, and Chih-Ming Chen* (陳志銘), 2022 May, “Influences of impurity incorporation in electroplated Cu on the SnAgCu and Ni-containing SnAgCu solder joints”, Journal of the Electrochemical Society, Vol. 169, 052508. (https://doi.org/10.1149/1945-7111/ac7105 )
     

  6. Yohanes Hutabalian, Chih-Ming Chen(陳志銘), Hsu-Hui Chen, Zhi-Kai Hu, and Sinn-Wen Chen*, 2022 April, “Interfacial reactions in Ni/Se-90 at.%Te and Ni/Pb1-xSnxSe couples”, Materials Chemistry and Physics, Vol. 282, 125959. (https://doi.org/10.1016/j.matchemphys.2022.125959 )
     

  7. Jhih-Jhu Jhan, Kazutoshi Wataya, Hiroshi Nishikawa, and Chih-Ming Chen* (陳志銘), 2022 March, “Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding”, Journal of the Taiwan Institute of Chemical Engineers, Vol. 132, 104127. (https://doi.org/10.1016/j.jtice.2021.10.027 )
     

  8. Shao-Yu Hsu, Chih-Ming Chen*(陳志銘), Jenn-Ming Song, and Hiroshi Nishikawa, 2022 February, “Surface modification of Cu electroplated layers for Cu-Sn transient liquid phase bonding”, Materials Chemistry and Physics, Vol. 277, 125621. (https://doi.org/10.1016/j.matchemphys.2021.125621 )
     

  9. Li-Chi Huang, Yan-Ping Zhang, Chih-Ming Chen* (陳志銘), Liang-Yih Hung, Yu-Po Wang, 2022 February, “Intermetallic compound formation and growth behavior at the interface between indium and Au/Ni(V) metallization”, Materials Characterization, Vol. 184, 111673. (https://doi.org/10.1016/j.matchar.2021.111673 )
     

  10. Ya-Ching Chang, Manik Chandra Sil, Yan-Ping Zhang, Shu-Chiao Chou, Ying-Xing Liu, Si-Yu Li*, and Chih-Ming Chen* (陳志銘), 2022 February, “Surface co-silanization engineering to enhance amine functionality for adhesive heterojunction and antimicrobial application”, Composites Science and Technology, Vol. 218, 109196. (https://doi.org/10.1016/j.compscitech.2021.109196 )

2021

  1. Yan-Ping Zhang, Manik Chandra Sil, and Chih-Ming Chen* (陳志銘), 2021 November, “Organosiloxane nanolayer as diffusion barrier for Cu Metallization on Si”, Applied Surface Science, Vol. 567, 150800. (https://doi.org/10.1016/j.apsusc.2021.150800 ) 
     

  2. Manik Chandra Sil, Hong-Da Chang, Jhih-Jhu Jhan, and Chih-Ming Chen* (陳志銘), 2021 September, “Electropolymerization of Poly(spiroBiProDOT) on Counter Electrode for Platinum-free Dye Sensitized Solar Cells”, Journal of Materials Chemistry C, Vol. 9, pp. 12094-12101. (https://doi.org/10.1039/D1TC02712C ) (Selected as Front Cover)
     

  3. Li-Syuan Chen, Manik Chandra Sil, Yu-Hsin Lee, Heng-Jui Liu*, and Chih-Ming Chen* (陳志銘), 2021 September, “Hybrid Titanium dioxide/Sericite light scattering layer to Enhance Light Harvesting of Dye-sensitized Solar Cells”, Electrochimica Acta, Vol. 390, 138820. (https://doi.org/10.1016/j.electacta.2021.138820 )
     

  4. Li-Syuan Chen, Manik Chandra Sil, Cheng-Chung Chang*, and Chih-Ming Chen* (陳志銘), 2021 July, “Optimization of Photoelectrode by Structural Engineering for Efficiency Improvement of Dye-sensitized Solar Cells at Different Light Intensity”, Journal of Alloys and Compounds, Vol. 870, 159478. (https://doi.org/10.1016/j.jallcom.2021.159478 )
     

  5. Ping-Chen Chiang, Yu-An Shen*, and Chih-Ming Chen* (陳志銘), 2021 May, “Effects of Impurities on Void Formation at the Interface between Sn-3.0Ag-0.5Cu and Cu Electroplated Films”, Journal of Materials Science: Materials in Electronics, Vol. 32, pp. 11944–11951. (https://doi.org/10.1007/s10854-021-05824-7 ) 
     

  6. Zeyang Zheng, Yu-Ting Huang, Zhenyu Wang, Chih-Chun Chung, Sheng-Jye Cherng, Wei-Ting Wang, Mingyang Zhang, Ya-Hui Tsai, Po-Chien Li, Zhouguang Lu, Chih-Ming Chen* (陳志銘), Shien-Ping Feng*, 2021 March, “Electrodeposition of (111)-oriented and nanotwin-doped nanocrystalline Cu with ultrahigh strength for 3D IC application”, Nanotechnology, Vol. 32, 225702. (https://orcid.org/0000-0002-3941-1363 )
     

  7. Yi-Hsiang Lai, Manik Chandra Sil, and Chih-Ming Chen* (陳志銘), 2021 March, “Surface composite engineering of polyimide to create amine functionalities for autocatalytic metallization”, Applied Surface Science, Vol. 541, 148500. (https://doi.org/10.1016/j.apsusc.2020.148500 )
     

  8. Ping-Chen Chiang, Yu-An Shen*, Shien-Ping Feng, and Chih-Ming Chen* (陳志銘), 2021 January, “Electrodeposition of Twinned Cu with Strong Texture Effect on Voiding Propensity in Electroplated Cu Solder Joints”, Journal of the Electrochemical Society, Vol. 167, 162516. (https://doi.org/10.1149/1945-7111/abd517 )

2020

  1. Manik Chandra Sil, Li-Syuan Chen, Chin-Wei Lai, Yu-Hsin Lee, Cheng-Chung Chang*, and Chih-Ming Chen* (陳志銘), 2020 December, “Enhancement of power conversion efficiency of dye-sensitized solar cells for indoor applications by using a highly responsive organic dye and tailoring the thickness of photoactive layer”, Journal of Power Sources, Vol. 479, pp. 229095. (https://doi.org/10.1016/j.jpowsour.2020.229095 )
     

  2. Jun-Nan Liu, Manik Chandra Sil, Rui Cheng, Shien-Ping Feng, and Chih-Ming Chen* (陳志銘), 2020 October, “Surface silanization of polyimide for autocatalytic metallization”, JOM, Vol. 72, pp. 3529–3537. (10.1007/s11837-020-04286-2)
     

  3. Manik Chandra Sil, Li-Syuan Chen, Chin-Wei Lai, Cheng-Chung Chang*, and Chih-Ming Chen* (陳志銘), 2020 September, “Enhancement in the solar efficiency of a dye-sensitized solar cell by molecular engineering of an organic dye incorporating N-alkyl-attached 1,8-naphthalamide derivative”, Journal of Materials Chemistry C, Vol. 8, pp. 11407-11416. (DOI: 10.1039/D0TC01388A) (Selected as “Back Cover”)
     

  4. Tzu-Jung Liu, Manik Chandra Sil, and Chih-Ming Chen* (陳志銘), 2020 June, “Well-organized Organosilane Composites for Adhesion Enhancement of Heterojunctions”, Composites Science and Technology, Vol. 193, pp. 108135. (10.1016/j.compscitech.2020.108135)
     

  5. Ping Heng Wu, Yu-Zhong Lai, Yan-Ping Zhang, Manik Chandra Sil, Po-Heng (Henry) Lee, Tzu-Chien Wei*, and Chih-Ming Chen* (陳志銘), 2020 April, “Organosiloxane Monolayers Terminated with Amine Groups as Adhesives for Si Metallization”, ACS Applied Nano Materials, Vol. 3, pp. 3741-3749. (10.1021/acsanm.0c00430)
     

  6. Yi-Hsuan Chen, Yi-Hsiang Lai, Ping Heng Wu, Li-Syuan Chen, Yung-Sen Lin, and Chih-Ming Chen* (陳志銘), 2020 March, “Mutual Intercropping-inspired Co-silanization to Graft Well-oriented Organosilane as Adhesion Promotion Nanolayer for Flexible Conductors”, Journal of Industrial and Engineering Chemistry, Vol. 83, pp. 90-99. (https://doi.org/10.1016/j.jiec.2019.11.017)
     

  7. Jenn-Ming Song*, Po-Jen Wang, Lap-Hong Chan, Chih-Ming Chen (陳志銘), Wen-Fu Ho, and Shih-Yun Chen, 2020 February, “Efficiency Enhancement of Dye-Sensitized Solar Cells Using Ti-Nb Alloy Photoanodes with Mesoporous Oxide Surface”, Journal of The Electrochemical Society, Vol. 167, pp. 046501. (DOI: 10.1149/1945-7111/ab6fef)
     

  8. Po-Fan Chan, Hsuan Lee, Shih-I Wen, Mao-Chun Hung, Chih-Ming Chen (陳志銘), and Wei-Ping Dow*, 2020 February, “Effect of Copper Grain Size on The Interfacial Microstructure of Sn/Cu Joint”, ACS Applied Electronic Materials, Vol. 2, pp. 464-472. (https://doi.org/10.1021/acsaelm.9b00720)
     

  9. Chia-Yuan Chen, Ting-Yang Kuo, Chien-Wu Huang, Zih-Hong Jian, Po-Tsung Hsiao, Chin-Li Wang, Jian-Ci Lin, Chien-Yu Chen, Chao-Hsuan Chen, Yung-Liang Tung, Ming-Chi Tsai, Kuan-Min Huang, Chih-Ming Chen (陳志銘), Cheng-Wei Hsu, Yen-Chiao Chen, Zingway Pei, Yogesh S. Tingare, Hsien-Hsin Chou, Chen-Yu Yeh, Ching-Yao Lin, Yuh-Lang Lee, Hao-Wu Lin, Hsin-Fei Meng, Chun-Guey Wu, and Pi-Tai Chou, 2020 February, “Thermal and angular dependence of next-generation photovoltaics under indoor lighting”, Progress in Photovoltaics: Research and Applications, Vol. 28, pp. 111-121. (DOI: 10.1002/pip.3211).
     

  10. Yu-Wen Chen, Manik Chandra Sil, and Chih-Ming Chen* (陳志銘), 2020 February, “Increasing Solar Light Efficiency by Engineering Cell Structures with Modified Ti Foil and Specific Concentrations of Electrolyte in Liquid Dye-Sensitized Solar Cells”, Electrochimica Acta, Vol. 334, pp. 135631 (https://doi.org/10.1016/j.electacta.2020.135631)
     

  11. Chia-Yu Liu, Po-Cheng Kuo, Chih-Ming Chen (陳志銘), Jia-Ying Dai, Yee-Wen Yen, and Alberto S. Pasana, 2020 January, “Effect of Multiple Reflowing Processes on Interfacial Reactions and Mechanical Properties between Sn-9.0 wt.%Zn, Sn-3.0 wt.%Ag-0.5 wt.%Cu Solders and Ag Substrate”, Journal of Electronic Materials, Vol. 49, pp. 257-267. (https://doi.org/10.1007/s11664-019-07752-z)

2019

  1. Kai-Wen Chen, Li-Syuan Chen, and Chih-Ming Chen*(陳志銘), 2019 August, “Post-treatment of Nb2O5 Compact Layer in Dye-sensitized Solar Cells for Low-level Lighting Applications”, Journal of Materials Science: Materials in Electronics, Vol. 30, pp. 15105-15115. (https://doi.org/10.1007/s10854-019-01883-z)
     

  2. Shan-Ting Tsai, Ping-Chen Chiang, Chang Liu, Shien-Ping Feng, and Chih-Ming Chen*(陳志銘), 2019 September, “Suppression of Void Formation at Sn/Cu joint Due to Twin Formation in Cu Electrodeposit”, JOM, Vol. 71, pp. 3012-3022. (Selected as Journal Cover). (https://doi.org/10.1007/s11837-019-03576-8)
     

  3. Tzu-Jung Liu, Chien-Han Chen, Pei-Yu Wu, Ching-Hsuan Lin*, and Chih-Ming Chen*(陳志銘), 2019 June, “Efficient and Adhesiveless Metallization of Flexible Polyimide by Functional Grafting of Carboxylic Acid Groups”, Langmuir, Vol. 35, pp. 7212-7221. (http://dx.doi.org/10.1021/acs.langmuir.9b00354)
     

  4. Zeyang Zheng, Ping-Chen Chiang, Yu-Ting Huang, Wei-Ting Wang, Po-Chien Li, Ya-Hui Tsai, Chih-Ming Chen*(陳志銘), and Shien-Ping Feng*, 2019 August, “Study of grain size effect of Cu metallization on interfacial microstructures of solder joints”, Microelectronics Reliability, Vol. 99, pp. 44-51. (https://doi.org/10.1016/j.microrel.2019.05.018).
     

  5. Hsuan-Ling Hsu, Hsuan Lee, Chi-Wei Wang, Chenju Liang*, and Chih-Ming Chen*(陳志銘), 2019 March, “Impurity evaporation and void formation in Sn/Cu solder joints”, Materials Chemistry and Physics, Vol. 225, pp. 153-158. (https://doi.org/10.1016/j.matchemphys.2018.12.036)
     

  6. Hsuan Lee, Shan-Ting Tsai, Ping-Heng Wu, Wei-Ping Dow, and Chih-Ming Chen*(陳志銘), 2019 January, “Influence of Additives on Electroplated Copper Films and Their Solder Joints”, Materials Characterization, Vol. 147, pp. 57-63. (https://doi.org/10.1016/j.matchar.2018.10.029)
     

  7. Yee-Wen Yen, William Yu, Chu-Hsuan Wang, Chih-Ming Chen (陳志銘), Yu-Chun Li, Pei-Yu Chen, and Guan-Da Chen, 2019 January, “Study of Interfacial Reactions between Lead-free Solders and Cu-xZn Alloys”, Journal of Electronic Materials, Vol. 48 (1), pp. 170-181. (https://doi.org/10.1007/s11664-018-6577-y)

2018

  1. Hsuan Lee, Yi-An Wang, and Chih-Ming Chen*(陳志銘), 2018 October, “Development of nanotwins in electroplated copper and its effect on shear strength of tin/copper joint”, Journal of Alloys and Compounds, Vol. 765, pp. 335-342. (https://doi.org/10.1016/j.jallcom.2018.06.247)
     

  2. Hsuan-Ling Hsu, Hsuan Lee, Ping-Heng Wu, Yee-Wen Yen, and Chih-Ming Chen*(陳志銘), 2018 August, “Impurity-induced Unusual Microstructural Evolution and Mechanical Property in Sn/Cu Solder Joints”, Journal of Materials Science: Materials in Electronics, Vol. 29 (15), pp. 12842-12849. (https://doi.org/10.1007/s10854-018-9403-7)
     

  3. Yen-Chiao Chen, Ya-Ching Chang, and Chih-Ming Chen*(陳志銘), 2018 July, “The Study of Blocking Effect of Nb2O5 in Dye-sensitized Solar Cells under Low Power Lighting”, Journal of The Electrochemical Society, Vol. 165 (7), pp. F409-F416. (DOI: 10.1149/2.0091807jes)
     

  4. Hsuan Lee and Chih-Ming Chen*(陳志銘), 2018 June, “Impurity Effects in Electroplated-Copper Solder Joints”, Metals, Vol. 8(6), 388. (doi: 10.3390/met8060388).
     

  5. Ying-Chen Chiang, Zi-Lun Lai, Chih-Ming Chen*(陳志銘), Cheng-Chung Chang*, and Bin Liu*, 2018, “Construction of emission-tunable nanoparticles based on a TICT-AIEgen: Impact of aggregation-induced emission versus twisted intramolecular charge transfer”, Journal of Materials Chemistry B, Vol. 6, pp. 2869-2876. (doi: 10.3390/met8060388) (DOI: 10.1039/C8TB00539G).
     

  6. Chih-Hsiang Huang, Yu-Wen Chen, and Chih-Ming Chen*(陳志銘), 2018 March, “Chromatic Titanium Photoanode for Dye-Sensitized Solar Cells under Rear Illumination”, ACS Applied Materials & Interfaces, Vol. 10 (3), pp. 2658-2666. (DOI: 10.1021/acsami.7b18351).
     

  7. Kamani Reddy, Yen-Chiao Chen, Chih-Chung Wu, Chia-Wei, Hsu, Ya-Ching Chang, Chih-Ming Chen*(陳志銘), and Chen-Yu Yeh*, 2018 March, “Co-sensitization of Structurally Simple Porphyrin and Anthracene-based Dye for Dye-Sensitized Solar Cells”, ACS Applied Materials & Interfaces, Vol. 10 (3), pp. 2391-2399. (https://doi.org/10.1021/acsami.7b12960)
     

  8. Gita Novian Hermana, Tzu-Ting Huang, Chih-Ming Chen(陳志銘), Chin-Hung Lin, Satoshi Iikubo, and Yee-Wen Yen*, 2018 February, “Phase Equilibria of the Cu-Ni-Zr Ternary Systems at 800 °C and Thermodynamic Assessment and Metallic Glass Region Prediction for the Cu-Ni-Zr Ternary System”, Journal of Non-Crystalline Solids, Vol. 481: 1, pp. 612-621. (https://doi.org/10.1016/j.jnoncrysol.2017.12.016)
     

  9. Yu-Chen Tseng, Hsuan Lee, Nga Yu Hau, Shien-Ping Feng, and Chih-Ming Chen*(陳志銘), 2018 January, “Electrodeposition of Ni on Bi2Te3 and Interfacial reaction between Sn and Ni-coated Bi2Te3”, Journal of Electronic Materials, Vol. 47 (1), pp. 27-34. (Editor Choice Article). (https://doi.org/10.1007/s11664-017-5777-1)

2017

  1. Yeng-Fong Shih*, Man-Yun Chou, Wen-Chuan Chang, Hong-Yuan Lian, and Chih-Ming Chen(陳志銘), 2017 November, “Completely Biodegradable Composites Reinforced by the Cellulose Nanofibers of Pineapple Leaves Modified by Eco-friendly Methods”, Journal of Polymer Research, Vol. 24: 209, pp. 1-12. (https://doi.org/10.1007/s10965-017-1367-4)
     

  2. Jyun-Wei Chen, Chih-Ming Chen*(陳志銘), and Cheng-Chung Chang*, 2017 September, “A fluorescent pH probe for acidic organelle in living cells”, Organic & Biomolecular Chemistry, Vol. 15, pp. 7936-7943. (   https://doi.org/10.1039/C7OB02037F)
     

  3. Pei-Yu Wu, Ching-Hsuan Lin, and Chih-Ming Chen*(陳志銘), 2017 May, “Study of Surface Metallization of Polyimide Film and Interfacial Characterization”, Metals, Vol. 7, pp. 189 (12 pages). (https://doi.org/10.3390/met7060189)
     

  4. Hsuan Lee, Tai-Yi Yu, Hsi-Kuei Cheng, Kuo-Chio Liu, Po-Fan Chan, Wei-Ping Dow*, and Chih-Ming Chen(陳志銘), 2017 July, “Impurity Incorporation in the Cu Electrodeposit and Its Effects on the Microstructural Evolution of the Sn/Cu Solder Joints”, Journal of The Electrochemical Society, Vol. 164, pp. D457-D462. (DOI: 10.1149/2.1171707jes)
     

  5. Yu-Jie Lin, Jyun-Wei Chen, Po-Tsung Hsiao, Yung-Liang Tung, Cheng-Chung Chang, and Chih-Ming Chen(陳志銘), 2017 April, “Efficiency Improvement of Dye-sensitized Solar Cells by In-situ Fluorescence Resonance Energy Transfer”, Journal of Materials Chemistry A, Vol. 5, pp. 9081-9089. (DOI: 10.1039/C7TA00638A).
     

  6. Chia-Yuan Chen, Zih-Hong Jian, Shih-Han Huang, Kun-Mu Lee, Ming-Hsuan Kao, Chang-Hong Shen, Jia-Min Shieh, Chin-Li Wang, Chiung-Wen Chang, Bo-Zhi Lin, Ching-Yao Lin, Ting-Kuang Chang, Yun Chi, Cheng-Yu Chi, Wei-Ting Wang, Yian Tai, Ming-De Lu, Yung-Liang Tung, Po-Ting Chou, Wen-Ti Wu, Tahsin J. Chow, Peter Chen, Xiang-Hao Luo, Yuh-Lang Lee, Chih-Chung Wu, Chih-Ming Chen(陳志銘), Chen-Yu Yeh, Miao-Syuan Fan, Jia-De Peng, Kuo-Chuan Ho, Yu-Nan Liu, Hsiao-Yi Lee, Chien-Yu Chen, Hao-Wu Lin, Chia-Te Yen, Yu-Ching Huang, Cheng-Si Tsao, Yu-Chien Ting, Tzu-Chien Wei, and Chun-Guey Wu, 2017 April, “Performance Characterization of Dye-Sensitized Photovoltaics Under Indoor Lighting”, Journal of Physical Chemistry Letters, Vol. 8 (8), pp. 1824-1830. (https://doi.org/10.1021/acs.jpclett.7b00515)
     

  7. Yu-Chen Tseng, Hsuan Lee, Shan-Chen Tsai, Yee-Wen Yen, and Chih-Ming Chen(陳志銘), 2017 June, “Suppression Effect of Ni Grain Size on the Ni3Sn4 Growth at the Sn/Ni Interface”, Materials Characterization, Vol. 128, pp. 232-237. (doi.org/10.1016/j.matchar.2017.04.013).
     

  8. Chih-Fan Lin, Nga Yu Hau, Yu-Ting Huang, Ya-Huei Chang, Shien-Ping Feng, Chih-Ming Chen(陳志銘), 2017 June, “Synergetic effect of Bi2Te3 alloys and electrodeposition of Ni for interfacial reactions at solder/Ni/Bi2Te3 joints”, Journal of Alloys and Compounds, Vol. 708, pp. 220-230. (https://doi.org/10.1016/j.jallcom.2017.02.300)

2016

  1. Tai-Yi Yu, Hsuan Lee, Hsuan-Ling Hsu, Wei-Ping Dow, Hsi-Kuei Cheng, Kuo-Chio Liu, and Chih-Ming Chen(陳志銘), October 2016, “Effects of Cu electroplating formulas on the interfacial microstructures of Sn/Cu joints”, Journal of The Electrochemical Society, Vol. 163, pp. D734-741. (DOI: 10.1149/2.0091614jes)
     

  2. Tzu-Ting Huang, Shih-Wei Lin, Chih-Ming Chen(陳志銘), Pei-Yu Chen, and Yee-Wen Yen, December 2016, “Phase Equilibria of the Fe-Ni-Sn Ternary System at 270 °C”, Journal of Electronic Materials, Vol. 45, pp. 6208-6213. (https://doi.org/10.1007/s11664-016-4787-8)
     

  3. Tzu-Hao Wang, Hsuan Lee, Chih-Ming Chen(陳志銘), Ming-Guan Chen, Chi-Chang Hu, Yu-Jie Chen, and Ray-Hua Horng, August 2016, “Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material”, Microelectronics Reliability, Vol. 63, pp. 68-75. (https://doi.org/10.1016/j.microrel.2016.06.012)
     

  4. Ting-Chien Liu, Chih-Chung Wu, Chih-Hsiang Huang, and Chih-Ming Chen(陳志銘), December 2016, “Effects of Ethyl Cellulose on Performance of Titania Photoanode for Dye-sensitized Solar Cells”, Journal of Electronic Materials, Vol. 45, pp. 6192-6199. (https://doi.org/10.1007/s11664-016-4719-7)
     

  5. Kuei-Chang Lai, Pei-Yu Wu, Chih-Ming Chen(陳志銘), Tzu-Chien Wei, Chung-Han Wu, and Shien-Ping Feng, October 2016, “Interfacial characterizations of a nickel-phosphorus layer electrolessly deposited on a silane-compound-modified silicon wafer under thermal annealing”, Journal of Electronic Materials, Vol. 45, pp. 4813-4822. (https://doi.org/10.1007/s11664-016-4708-x)
     

  6. H.-K. Cheng, Y.-J. Lin, C.-M. Chen(陳志銘), K.-C. Liu, Y.-L. Wang, and T.-F. Liu, August 2016, “Microstructural evolution of Cu/solder/Cu pillar-type structures with different diffusion barriers”, Metallurgical and Materials Transactions A, Vol. 47, pp. 3971-3980. (https://doi.org/10.1007/s11661-016-3591-7)
     

  7. H.-M. Hsiao, Y.-W. Chang, C.-M. Chen(陳志銘), P.-Y. Chen, Y.-P. Wu, Y.-W. Yen, July 2016, “Phase equilibria in the Au-Bi-Sn ternary system at temperatures of 80, 125, and 150 °C”, International Journal of Materials Research, Vol. 107, pp. 615-623. (DOI: 10.3139/146.111380)
     

  8. H.-T. Chan, C.-F. Lin, Y.-W. Yen, and C.-M. Chen(陳志銘), May 2016, “Effects of current stressing on the p-Bi2Te3/Sn interfacial reactions”, Journal of Alloys and Compounds, Vol. 668, pp. 91-96. (https://doi.org/10.1016/j.jallcom.2016.01.204)

2015

  1. L.-C. Cheng, C.-M. Chen(陳志銘), M.-G. Chen, C.-C. Hu, H.-Y. Jiang, R.-H. Horng and D.-S. Wuu, 2015 August, “A high-temperature die-bonding structure fabricated at low temperature for light-emitting diodes”, IEEE Electron Device Letters, Vol. 36, pp. 835-837.
     

  2. S. Ye, J.-D. Hwang, and C.-M. Chen(陳志銘), 2015 June, “Strong anisotropic effects of p-type Bi2Te3 element on the Bi2Te3/Sn interfacial reactions”, Metallurgical and Materials Transactions A, Vol. 46, pp. 2372-2375.
     

  3. H.-K. Cheng, Y.-J. Lin, H.-C. Chang, K.-C. Liu, Y.-L. Wang, T.-F. Liu, and C.-M. Chen(陳志銘), 2015 May, “Unusual morphological evolution of the Cu pillar/solder micro-joints during high-temperature annealing”, Metallurgical and Materials Transactions A, Vol. 46, pp. 1834-1837.
     

  4. T.-C. Wei, T.-C. Pan, C.-M. Chen(陳志銘), K.-C. Lai, and C.-H. Wu, 2015 May, “Annealing-free adhesive electroless deposition of nickel/phosphorous layer on silane-compound modified Si wafer”, Electrochemistry Communications, Vol. 54, pp. 6-9.
     

  5. Y.-W. Yen, C.-W. Chiu, C.-M. Chen(陳志銘), M.-T. Lai, and J.-Y. Dai, 2015 March, “Interfacial Reactions in Sn/Ni-xW Couples”, Journal of Electronic Materials, Vol. 44, pp. 909-915.
     

  6. C.-C. Chou, K.-Y. Tsao, C.-C. Wu, H. Yang, and C.-M. Chen(陳志銘), 2015 February, “Improved power conversion efficiency for dye-sensitized solar cells using a subwavelength-structured antireflective coating”, Applied Surface Science, Vol. 328, pp. 198-204.
     

  7. H.-K. Cheng, C.-W. Huang, H. Lee, Y.-L. Wang, T.-F. Liu, and C.-M. Chen(陳志銘), 2015 February, “Interfacial Reactions between Cu and SnAgCu solder doped with minor Ni”, Journal of Alloys and Compounds, Vol. 622, pp. 529-534.
     

  8. T.-K. Yang, C.-F. Lin, and C.-M. Chen(陳志銘), 2015 January, “Interfacial Reactions between Cu-Ag alloy substrates and Sn”, Journal of Electronic Materials, Vol. 44, pp. 511-517.
     

  9. Y.-J. Lin, C.-C. Chang, S.-J. Cherng, J.-W. Chen, and C.-M. Chen(陳志銘), 2015 January, “Manipulation of light harvesting for efficient dye-sensitized solar cell by doping an ultraviolet light-capturing fluorophore”, Progress in Photovoltaics: Research and Applications, Vol. 23, pp. 106-111.

2014

  1. C.-F. Lin, C.-M. Chen(陳志銘), W.-P. Dow, H.-H. Liu, H.-C. Tien, S.-F. Lee, and W.-M. Chen, 2014 October, "Intermetallic Compound Formation and Mechanical Property of Inner Lead Bonding Joints", IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 4, pp. 1739-1744.
     

  2. J.-Y. Wu, H. Lee, C.-H. Wu, C.-F. Lin, W.-P. Dow, and C.-M. Chen(陳志銘), 2014 October, "Effects of Electroplating Additives on the Interfacial Reactions between Sn and Cu Electroplated Layers", Journal of The Electrochemical Society, Vol. 161, pp. D522-D527.
     

  3. F.-C. Hsu, Y.-C. Cheng, Y.-T. Wang, M.-T. Lin, C.-M. Chen(陳志銘), 2014 June-July, "Planar copper-tin intermetallic film formation on strained substrates", Microelectronics Reliability, Vol. 54, pp. 1378-1383.
     

  4. Y.-H. Chang, Y.-T. Huang, M.-K. Lo, C.-F. Lin, C.-M. Chen(陳志銘), S.-P. Feng, 2014 June, "Electrochemical Fabrication of Transparent Nickel Hydroxide Nanostructures with Tunable Superhydrophobicity/Superhyrophilicity for 2D Microchannels Application", Journal of Materials Chemistry A, Vol. 2, pp. 1985-1990.
     

  5. P.-K. Chuang, Y.-J. Lin, C.-M. Chen(陳志銘), and C.-C. Chang, 2014 June, "Improved power conversion efficiency of dye-sensitized solar cells by fluorophore-assisted spectrum down-conversion", Journal of The Electrochemical Society, Vol. 161, pp. H404-H409.
     

  6. C.-P. Lin, C.-M. Chen(陳志銘) and Y.-W. Yen, 2014 April, "Enhanced growth of the Cu6Sn5 phase in the Sn/Ag/Cu and Sn/Cu multilayers subjected to applied strain", Journal of Alloys and Compounds, Vol. 591, pp. 297-303.
     

  7. F. Xie, S.-J. Cherng, S. Lu, Y.-H. Chang, W. Sha, S.-P. Feng, C.-M. Chen(陳志銘), W. Choy, 2014 March, "The Functions of Self-assembled Ultrafine TiO2 Nanocrystals for High Efficient Dye-Sensitized Solar Cells", ACS Applied Materials & Interfaces, Vol. 6, pp. 5367-5373.
     

  8. H.-K. Cheng, S.-P. Feng, Y.-J. Lai, K.-C. Liu, Y.-L. Wang, T.-F. Liu, and C.-M. Chen(陳志銘), 2014 March, "Effect of Polyimide Baking on Bump Resistance in Flip-Chip Solder Joints", Microelectronics Reliability, Vol. 54, pp. 629-632.
     

  9. H.-F. Ting, C.-M. Chen(陳志銘), F.-H. Lu, S.-Y. Suen, 2014 March, "Adsorption and photodegradation of methylene blue using a bulk Ti material with porous titania layer prepared by chemical oxidation", Journal of the Taiwan Institute of Chemical Engineers, Vol. 45, pp. 617-624.
     

  10. Y.-W. Yen, R.-S. Syu, C.-M. Chen(陳志銘), C.-C. Jao, G.-D. Chen, 2014 January, "Interfacial Reactions of Sn-58Bi and Sn-0.7Cu Lead-free Solders with Alloy42 Substrate Microelectronics Reliability", Microelectronics Reliability, Vol. 54, pp. 233-238.
     

  11. J.-Y. Wang, C.-M. Chen(陳志銘), and Y.-W. Yen, 2014 January, "Interfacial reactions of high-Bi alloys on various substrates", Journal of Electronic Materials, Vol. 43, pp. 155-165.

2013

  1. C.-Y. Hsu, S.-J. Cherng, Y.-J. Lin and C.-M. Chen(陳志銘), 2013 November, “A Compact Nano-TiO2 Underlayer for Efficient Dye-sensitized Solar Cell”, IEEE Electron Device Letters, Vol. 34, pp. 1415-1417.
     

  2. Y.-T. Huang, Y.-Y. Zhan, S.-J. Cherng, C.-M. Chen(陳志銘), S.-P. Feng, T.-C. Wei, 2013 September, "Surface metallization of polyimide as a photoanode substrate for rear-illuminated dye-sensitized solar cells", Journal of The Electrochemical Society, Vol. 160, H581-H586.
     

  3. Y.-T. Huang, S.-P. Feng, and C.-M. Chen(陳志銘), 2013 June, “Nickel Substrate covered with a Sn-based Protection Bi-layer as a Photoanode Substrate for Dye-sensitized Solar Cells”, Electrochimica Acta, Vol. 99, pp. 230-237.
     

  4. T.-Y. Tsai, C.-M. Chen(陳志銘), S.-J. Cherng, and S.-Y. Suen, 2013 March, “An efficient titanium-based photoanode for dye-sensitized solar cell under back-side illumination”, Progress in Photovoltaics: Research and Applications, Vol. 21, pp. 226-231.
     

  5. C.-P. Lin and C.-M. Chen(陳志銘), 2013 January, “The cross-interactions in the Ni/Sn/Cu diffusion couples with an electroless palladium surface finish”, Journal of Alloys and Compounds, Vol. 547, pp. 37-42.
     

  6. J.-Y. Wu, C.-M. Chen(陳志銘), R.-H. Horng, and D.-S. Wuu, 2013 January, “An efficient metal-core printed-circuit board with a copper-filled through (blind) hole for light-emitting diodes”, IEEE Electron Device Letters, Vol. 34, pp. 105-107.
     

  7. P.-H. Lee, C.-P. Lin, and C.-M. Chen(陳志銘), 2013 January, “Retardation of the Cu5Zn8 phase fracture and improvement of shear strength of the Sn-9 wt.% Zn/Cu interface by inserting an electroless Palladium layer”, Metallurgical and Materials Transactions A, Vol. 44A, pp. 125-130.

2012

  1. T.-C. Wei, S.-P. Feng, Y.-H. Chang, S.-J. Cherng, Y.-J. Lin, C.-M. Chen(陳志銘), H.-H. Chen, 2012 December, “Fabrication and Characterization of Interconnected Grid-type Dye-Sensitized Solar Modules”, International Journal of Electrochemical Science, Vol. 7, pp. 11904-11916.
     

  2. J.-Y. Wang, C.-F. Lin, and C.-M. Chen(陳志銘), 2012 December, “Interfacial reactions and mechanical properties of the Bi-x wt.% Sn/Cu joints (x= 2, 5, and 10)”, Journal of Electronic Materials, Vol. 41, pp. 3303-3308.
     

  3. H.-A. Pan, C.-P. Lin, and C.-M. Chen(陳志銘), 2012 September, “Interfacial reaction of molten Sn on a strained Cu electroplated layer”, Journal of Electronic Materials, Vol. 41, pp. 2470-2477.
     

  4. C.-F. Lin, S.-H. Lee, and C.-M. Chen(陳志銘), 2012 August, “Effect of Sn grain orientation on the Cu6Sn5 formation in a Sn-based solder under current stressing”, Metallurgical and Materials Transactions A, Vol. 43A, pp. 2571-2573.
     

  5. B.-H. Liou, C.-M. Chen(陳志銘), R.-H. Horng, Y.-C. Chiang, and D.-S. Wuu, 2012 May, ”Improvement of thermal management of high-power GaN-based light-emitting diodes”, Microelectronics Reliability, Vol. 52, pp. 861-865.
     

  6. C.-P. Lin and C.-M. Chen(陳志銘), 2012 February, “Solid-state interfacial reactions at the solder joints employing Ni/Pd/Au and Ni/Au as the surface finish metallizations”, Microelectronics Reliability, Vol. 52, pp. 385-390.

2011

  1. W.-K. Liao, C.-M. Chen(陳志銘), M.-T. Lin, C.-H. Wang, 2011 October, “Enhanced growth of the Ni3Sn4 phase at the Sn/Ni interface subjected to strains”, Scripta Materialia, Vol. 65, pp. 691-694.
     

  2. S.-H. Lee and C.-M. Chen(陳志銘), 2011 September, “Electromigration in a Sn-3wt.%Ag-0.5wt.%Cu-3wt.%Bi solder stripe between two Cu electrodes under current stressing”, Journal of Electronic Materials, Vol. 40, pp. 1943-1949.
     

  3. S.-J. Cherng, C.-M. Chen(陳志銘), W.-P. Dow, C.-H. Lin, and S.-W. Chen, 2011 July, “Chemical deposition of Ni/Pt bi-layer on polyimide film as flexible counterelectrodes for dye-sensitized solar cells”, Electrochemical and Solid State Letters, Vol. 14, P13-P15.
     

  4. Y.-T. Huang, Y.-W. Lin, and C.-M. Chen(陳志銘), 2011 May, “Characterization of carbon nanomaterials synthesized from thermal decomposition of paper phenolic board”, Materials Chemistry and Physics, Vol. 127, pp. 397-404.
     

  5. J.-L. Lan, C.-C. Wan, T.-C. Wei, W.-C. Hsu, C. Peng, Y.-H. Chang, and C.-M. Chen(陳志銘), 2011 May, “Improvement of Photovoltaic Performance of Dye-Sensitized Solar Cell by Post Heat Treatment of Polymer-Capped Nano-Platinum Counterelectrode”, International Journal of Electrochemical Science, Vol. 6, pp. 1230-1236.
     

  6. J.-Y. Wang, C.-F. Lin, and C.-M. Chen(陳志銘), 2011 April, “Retarding the Cu5Zn8 phase fracture at the Sn-9 wt.% Zn/Cu interface”, Scripta Materialia, Vol. 64, pp. 633-636.
     

  7. C.-M. Chen(陳志銘), Y.-C. Hsu, and S.-J. Cherng, 2011 January, “Effects of annealing conditions on the properties of TiO2/ITO-based photoanode and the photovoltaic performance of dye-sensitized solar cells”, Journal of Alloys and Compounds, Vol. 509, pp. 872-877.

2010

  1. C.-J. Chen, C.-M. Chen(陳志銘), R.-H. Horng, D.-S. Wuu, and J.-S. Hong, 2010 December, “Thermal management and interfacial properties in high-power GaN-based light-emitting diodes employing diamond-added Sn-3wt.%Ag-0.5wt.%Cu solder as die attach materials”, Journal of Electronic Materials, Vol. 39, pp. 2618-2626.
     

  2. C.-M. Chen(陳志銘), C.-H. Chen, S.-J. Cherng, and T.-C. Wei, 2010 November, “Electroless deposition of platinum on indium tin oxide glass as the counterelectrode for dye-sensitized solar cells”, Materials Chemistry and Physics, Vol. 124, pp. 173-178.
     

  3. J.-S. Hong, R.-H. Horng*, Y.-L. Tsai, D.-S. Wuu, C.-M. Chen(陳志銘), and C.-J. Chen, 2010 September, “Optimized Thermal Management from Chip to Heat Sink for High-Power GaN-Based Light-Emitting Diodes”, IEEE Transactions on Electron Devices, Vol. 57, pp. 2203-2207.
     

  4. S.-J. Cherng, Y.-C. Hsu, and C.-M. Chen(陳志銘), 2010 September, “Mitigation of Solvent Evaporation in Dye-Sensitized Solar Cells Based on Liquid Electrolyte by Introducing Regular-fencing-patterned Polymer Films”, Journal of the Chinese Institute of Engineers, Vol. 33, pp. 791-797.
     

  5. C.-P. Lin, C.-M. Chen(陳志銘), C.-H. Lin, and W.-C. Su, 2010 July, “Interfacial reactions of Sn/Ag/Cu tri-layer on a deformed polyimide substrate”, Journal of Alloys and Compounds, Vol. 502, pp. L17-L19.
     

  6. Y.-W. Lin, P.-Y. Shih, and C.-M. Chen(陳志銘), 2010 March, “A current-induced localized heating technique for fabrication of carbon nanomaterials”, Journal of Alloys and Compounds, Vol. 492, pp. 521-524.
     

  7. C.-M. Chen(陳志銘), C.-H. Chen, and T.-C. Wei, 2010 February, “Chemical deposition of platinum on metallic sheets as counterelectrodes for dye-sensitized solar cells”, Electrochimica Acta, Vol. 55, pp. 1687-1695.

2009

  1. C.-M. Chen(陳志銘), H.-S. Shiu, S.-J. Cherng, and T.-C. Wei, MAR 2009, “Preparation of polymer film of micro-porous or island-like structure and its application in dye-sensitized solar cell”, Journal of Power Sources, Vol. 188, pp. 319-322.
     

  2. H.-M. Chung, C.-M. Chen(陳志銘), C.-P. Lin, and C.-J. Chen, OCT 2009, “Microstructural Evolution of the Au-20 wt.% Sn Solder on the Cu Substrate During Reflow”, Journal of Alloys and Compounds, Vol. 485, pp. 219-224.
     

  3. C.-P. Lin and C.-M. Chen(陳志銘), JUN 2009, “Intermetallic compound formation and evolution in the solid-state Sn/immersion-Ag/Cu tri-layer interfacial reactions on a flexible polymer board”, Journal of Electronic Materials, Vol. 38, pp. 908-914.
     

  4. C.-M. Chen(陳志銘) and Y.-J. Chen, JUL 2009, “Growth orientation of the tin whiskers on an electrodeposited Sn layer under three-point bending”, Materials Letters, Vol. 63, pp. 1517-1520.
     

  5. C.-M. Chen(陳志銘), Y.-M. Hung, and C.-H. Lin, MAY 2009, “Electromigration of Sn-8 wt.% Zn-3 wt.% Bi and Sn-9 wt.% Zn-1 wt.% Cu solders”, Journal of Alloys and Compounds, Vol. 475, pp. 238-244.
     

  6. C.-M. Chen(陳志銘), Y.-M. Hung, C.-P. Lin, and W.-C. Su, MAY 2009, “Effect of temperature on microstructural changes of the Sn-9 wt.% Zn lead-free solder stripe under current stressing”, Materials Chemistry and Physics, Vol. 115, pp. 367-370.
     

  7. Y.-J. Chen and C.-M. Chen(陳志銘), MAR 2009, “Mitigative tin whisker growth under mechanically applied tensile stress”, Journal of Electronic Materials, Vol. 38, pp. 415-419.
     

  8. C.-M. Chen(陳志銘), P.-Y. Shih, and Y.-W. Lin, JAN 2009, “Synthesis of nanostructured carbon materials on a tin thin film using phenol formaldehyde as the carbon source”, Journal of Electronic Materials, Vol. 38, pp. 193-199.
     

  9. C.-H. Chen, C.-P. Lin, and C.-M. Chen(陳志銘), JAN 2009, “Effect of Cu thickness on the evolution of the reaction products at the Sn-9 wt.% Zn solder/Cu interface during reflow”, Journal of Electronic Materials, Vol. 38, pp. 61-69.

2008

  1. C.-M. Chen(陳志銘) and P.-Y. Shih, 2008, “A peculiar composite structure of carbon nanofibers growing on a micro-sized tin whisker”, Journal of Materials Research, Vol. 23(10), pp. 2668-2673.
     

  2. C.-M. Chen(陳志銘), C.-H. Chen, and C.-P. Lin, and W.-C. Su, 2008, “Morphological evolution of reaction product at Sn-9 wt.% Zn/thin-film Cu interface”, Journal of Electronic Materials, Vol. 37(10), pp. 1605-1610.
     

  3. C.-M. Chen(陳志銘) and C.-C. Huang, 2008, “Effects of silver doping on electromigration of eutectic SnBi solder”, Journal of Alloys and Compounds, Vol. 461, pp. 235-241.
     

  4. Y.-M. Hung and C.-M. Chen(陳志銘), 2008, “Electromigration of Sn-9 wt.% Zn solder”, Journal of Electronic Materials, Vol. 37, pp. 887-893.
     

  5. C.-M. Chen(陳志銘) and C.-C. Huang, 2008, “Atomic migration in eutectic SnBi solder alloy due to current stressing”, Journal of Materials Research, Vol. 23, pp. 1051-1056.

2007

  1. C.-M. Chen(陳志銘) and C.-H. Chen, 2007, “Interfacial reactions between eutectic SnZn solder and bulk or thin-film Cu substrates”, Journal of Electronic Materials, Vol. 36(10), pp. 1363-1371.
     

  2. C.-M. Chen(陳志銘), C.-C. Huang, C.-N. Liao, and K.-M. Liou, 2007, “Effects of copper doping on microstructural evolution in eutectic SnBi solder stripes under annealing and current stressing”, Journal of Electronic Materials, Vol. 36, pp. 760-765.
     

  3. T.-C. Wei, C.-C. Wan, Y.-Y. Wang, C.-M. Chen(陳志銘), and H.-S. Shiu, 2007, “Immobilization of poly (N-vinyl-2-pyrrolidone)-capped platinum nano-clusters on indium-tin oxide glass and its application in dye-sensitized solar cells”, Journal of Physical Chemistry C, Vol. 111, pp. 4847-4853.
     

  4. C.-M. Chen(陳志銘), K.-Z. Wang, and K.-C. Chen, 2007, “Isothermal solid-state aging of Pb-5Sn solder bump on Ni/Cu/Ti under bump metallization”, Journal of Alloys and Compounds, Vol. 432, pp. 122-128.
     

  5. C.-M. Chen(陳志銘), L.-T. Chen, and Y.-S. Lin, 2007, “Electromigration-induced Bi segregation in eutectic SnBi solder joint”, Journal of Electronic Materials, Vol. 36(2), pp. 168-172.

2006

  1. C.-M. Chen(陳志銘) and H.-C. Lin, 2006, “Interfacial reactions and mechanical properties of ball-grid-array solder joints using Cu-cored solder balls”, Journal of Electronic Materials, Vol. 35, pp. 1937-1947.
     

  2. L.-T. Chen and C.-M. Chen(陳志銘), 2006, “Electromigration study in the eutectic SnBi solder joint on the Ni/Au metallization”, Journal of Materials Research, Vol. 21(4), pp. 962-969.

2005

  1. K.-Z. Wang and C.-M. Chen(陳志銘), 2005, “Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with the Ti/Cu/Ni under bump metallization during reflow soldering”, Journal of Electronic Materials, Vol. 34(12), pp. 1543-1549.

2003

  1. M.-Y. Du, C.-M. Chen(陳志銘), S.-W. Chen, 2003, “Effects upon interfacial reactions by electric currents of reversing directions”, Materials Chemistry and Physics, Vol. 82, pp. 818-825.
     

  2. C.-M. Chen(陳志銘) and S.-W. Chen, 2003, “Electromigration effects upon the low-temperature Sn/Ni interfacial reactions”, Journal of Materials Research, Vol. 18(6), pp. 1293-1296.
     

  3. J.-I. Lee, S.-W. Chen, H.-Y. Chang and C.-M. Chen(陳志銘), 2003, “Reactive Wetting between Molten Sn-Bi and Ni Substrate”, Journal of Electronic Materials, Vol. 32(3), pp. 117-122.
     

  4. S.-W. Chen and C.-M. Chen(陳志銘), 2003, “Electromigration Effects upon Interfacial Reactions”, JOM, Vol. 55(2), pp. 62-67.

2002

  1. C.-M. Chen(陳志銘) and S.-W. Chen*, 2002, “Electromigration Effect upon the Sn/Ag and Sn/Ni Interfacial Reactions at Various Temperatures”, Acta Materialia, Vol. 50, pp. 2461-2469.

2001

  1. C.-M. Chen(陳志銘) and S.-W. Chen*, 2001, “Electromigration Effect upon the Sn-0.7wt%Cu/Ni and Sn-3.5wt%Ag/Ni Interfacial Reactions”, Journal of Applied Physics, Vol. 90(3), pp.1208-1214.

2000

  1. C.-M. Chen(陳志銘)and S.-W. Chen*, 2000, “Electromigration Effect upon the Zn/Ni and Bi/Ni Interfacial Reactions”, Journal of Electronic Materials, Vol. 29(10), pp. 1222-1228.
     

  2. S.-W. Chen, C.-S. Ho, C.-H. Lin and C.-M. Chen(陳志銘), 2000, “The 900℃ Isothermal Section of Ti-Ni-V Alloys”, Metallurgical and Materials Transactions A, Vol. 31A, pp. 1679-1682.

1999

  1. C.-M. Chen(陳志銘) and S.-W. Chen*, 1999, “Electric Current Effects on Sn/Ag Interfacial Reactions”, Journal of Electronic Materials, Vol. 28(7), pp. 902-906.

1998

  1. S.-W. Chen, C.-C. Lin and C.-M. Chen(陳志銘), 1998, “Determination of the Melting and Solidification Characteristics of Solders Using Differential Scanning Calorimetry”, Metallurgical and Materials Transactions A, Vol. 29A, pp. 1965-1972.
     

  2. S.-W. Chen, C.-M. Chen(陳志銘), and W.-C. Liu, 1998, “Electric Current Effects upon the Sn/Cu and Sn/Ni Interfacial Reactions”, Journal of Electronic Materials, Vol. 27(11), pp. 1193-1198.
     

  3. W.-C. Liu, S.-W. Chen*, and C.-M. Chen(陳志銘), 1998, “The Al/Ni Interfacial Reactions under the Influence of Electric Current”, Journal of Electronic Materials, Vol. 27(1), pp. L5-L8.

bottom of page